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Polishing pad, lap hole cover, polishing device, polishing method, and method of manufacturing semiconductor device

A polishing pad and platform technology, which is applied in semiconductor/solid-state device manufacturing, manufacturing tools, grinding tools, etc., can solve the problems of substrate surface scratches and measurement accuracy, and achieve the effect of less scratches on the substrate surface

Inactive Publication Date: 2005-07-13
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in a polishing pad using such a transparent hard uniform resin as a window member, since the window member comes into contact with the surface to be polished, that is, the surface of the substrate, there is a problem that scratches are likely to occur on the surface of the substrate.
In addition, since the window member is not in uniform contact with the surface to be polished, that is, the surface of the substrate, the slurry is sandwiched between the window member and the substrate surface, scattering light reflected by the substrate surface, and there is a problem that sufficient measurement accuracy cannot be obtained.

Method used

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  • Polishing pad, lap hole cover, polishing device, polishing method, and method of manufacturing semiconductor device
  • Polishing pad, lap hole cover, polishing device, polishing method, and method of manufacturing semiconductor device
  • Polishing pad, lap hole cover, polishing device, polishing method, and method of manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0127] Toray Co., Ltd. Toyuratsuku 920 (transparent ABS resin) is used at a molding temperature of 60°C to 80°C, and a metal mold is used to make a thickness of 0.4mm, a width and a length of 18.5×56.5mm, and 4 corners and 4 pieces on the top. Light-transmitting window parts of transparent ABS with 0.4mm R attached to the edge. The micro-rubber A hardness of the light-transmitting window component is 99 degrees. A polishing pad on which a 1 mm NBR rubber sheet was bonded to Rodel Corporation IC-1000 was produced. An opening of 19.5×57.5 mm was dug at the same position as the plate hole of the polishing pad. On the rubber side of the polishing pad from which the opening was removed, 442J double-sided tape manufactured by Sumitomo 3M Co., Ltd. was stuck, and a 13×50 mm cut-through was formed at the double-sided tape portion in the center of the opening. Prepare a high-deformation part with a thickness of 1.8mm made of EPT sponge EPT#140 of Yamato Boshoku Co., Ltd., stick 442J ...

Embodiment 2

[0129]The same transparent ABS light-transmitting window member as in Example 1 was produced. Prepare a high-deformation part with a thickness of 1.7mm of Yamato Bosho Co., Ltd. EPT sponge EPT#300 in advance, and paste Sumitomo 3M Co., Ltd. 442J double-sided tape on both sides, and form 13×50mm in the center according to the size of 18.5×56.5mm digging through the incision. The cushion member and the light-transmitting window member are joined together to manufacture a platform hole cover. An NBR rubber sheet of 1 mm was bonded to Rodel IC-1000, and 442J double-sided adhesive tape manufactured by Sumitomo 3M Co., Ltd. was pasted on the back side of the rubber to prepare a polishing pad. At the same position as the platform hole cover of the polishing pad, an opening of 21×59 mm was formed. The amount of extrusion deformation when a weight of 3000 g is applied to the portion of the light-transmitting window member of the platform hole cover is 0.15 mm by means of a press-fit ...

Embodiment 3

[0132] MMA was polymerized, and a 0.3 mm plate of PMMA was produced, which was coated with single-component silicon SE9185 manufactured by Toray Dow Corning Silicon Co., Ltd., and laminated with a thickness of 0.3 mm to produce a light-transmitting window member of 18.5×56.5 mm with a thickness of 0.6 mm. The microrubber A hardness of the silicone rubber side is 50 degrees, and the microrubber A hardness of the PMMA side is 99 degrees. A foamed polyurethane sheet with a thickness of 1 mm and a density of 0.1 was bonded to an IC-1000 made by Rodel Corporation to produce a polishing pad. An opening of 19.5×57.5 mm was formed by digging at the same position as the plate hole of the polishing pad. 442J double-sided adhesive tape manufactured by Sumitomo 3M Co., Ltd. was pasted on the polyurethane foam sheet side of the polishing pad that dug the opening, and a 13×50 mm cut-through was formed at the double-sided tape portion in the center of the opening. Prepare a high-deformation...

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Abstract

The purpose of the present invention is to be used in the polishing pad with window or platform hole cover that is used to form flat surface on glass, semiconductor, dielectric / metal composite body and integrated circuit etc. In the device and the manufacturing method and polishing method of a semiconductor device using the polishing device, a polishing pad with a window or a platform hole cover with less scratches on the surface of the substrate, which can optically measure the polishing state during polishing, and the polishing pad with the window are provided. A grinding device for a pad or a hole cover of the platform, a manufacturing method and a grinding method for a semiconductor device. It is a polishing pad having a polishing layer and a light-transmitting window member for optically measuring the polishing state on an opening formed on a part of the polishing layer, and is characterized in that, approximately the entire upper surface of the light-transmitting window part The amount of extrusion deformation when a certain load is applied to the surface is greater than the amount of extrusion deformation when the same constant weight is applied to the same area on the polishing layer part. By setting such a polishing pad, the above-mentioned purpose can be achieved.

Description

technical field [0001] The present invention relates to a polishing pad with a window, a platform hole cover, a polishing device having the above-mentioned parts, and a semiconductor device using the polishing device, which are very suitable for forming a flat surface on a semiconductor, a dielectric / metal complex, and an integrated circuit. Manufacturing method. Background technique [0002] With the increase in the density of semiconductor devices, the importance of technologies such as the formation of multilayer wiring and the subsequent formation of interlayer insulating films or the formation of electrodes such as plugs and damascenes has increased. Accordingly, the importance of a planarization process for these interlayer insulating films or metal films of electrodes has increased, and a polishing technique called CMP (Chemical Mechanical Polishing) has been widely used as an effective technique for this planarization process. In the polishing apparatus adopting thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/20B24D13/14
CPCB24B37/205H01L21/304
Inventor 城邦恭小林勉桥阪和彦
Owner TORAY IND INC