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Polyurethane resin based slush molding material

一种树脂、中空的技术，应用在行人/乘员安全布置、车辆安全安排、运输和包装等方向

Inactive Publication Date: 2005-07-27
SANYO CHEM IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the above solution doesn't seem to solve the problem completely

Method used

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  • Polyurethane resin based slush molding material
  • Polyurethane resin based slush molding material
  • Polyurethane resin based slush molding material

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0184] The manufacturing method of the instrument panel cover of the present invention may suitably include a step of thermally molding the aforementioned material, and a step of forming a tearing line for tearing on the molded material obtained in the previous step, wherein the tearing line will not be exposed. On the design side.

[0185] The above-mentioned heat molding step is not particularly limited, and a known method can be used. For example, it could also be the hollow molding method used in the conventional manufacture of instrument panel housings.

[0186] The above-mentioned step of forming the tear line is also not particularly limited, and a known method may be used. For example, laser processing, blade press processing, etc. are used to form tear lines on the back of the instrument panel.

[0187] This tear line will tear the shell material along the tear line when the airbag is inflated.

Embodiment

[0189] In the following, Preparation Examples and Examples are provided to explain the present invention in more detail, but the present invention is not limited to these Examples.

[0190] Among the raw materials in the following examples, polyol I is PBA with Mn of 1000, polyol II is PHIP with Mn of 900, and polyol III is polyethylene adipate with Mn of 2000. Stabilizer I is Irganox 1010, purchased from Ciba Fine Chemical Co., Ltd.; titanium dioxide is TipaqueR-820, purchased from Ishihara Industry (strain); Dispersant I is Sansparl PS-8, purchased from Sanyo Chemical Industry (strain); Amine I is MEK ketimine of HAD, ketimine II is MEK ketimine of hydrogenated MDA; ketimine III is MEK ketimine of isophorone diamine; disperser I is Ultradisperser , purchased from Yamato Scientific Co., Ltd.; Plasticizer I is CR741, purchased from Dahachi Chemical Co., Ltd. [Phosphate ester represented by general formula (5), wherein R is phenyl, q is 1, and R' is -ph-isopropylidene-ph-]; pl...

preparation example 1-8

[0192] Up solutions (Up1-Up8) were prepared according to the scheme in Table 1 below (parts by weight, expressed in parts in the table).

[0193] In a reaction vessel equipped with a thermometer, a stirrer and a nitrogen blowing pipe, polyols, low molecular weight diols and 1-octanol were charged, the air therein was exchanged with nitrogen, the resulting mixture was heated to 110° C., and stirred until melted. To this was then added the diisocyanate and the mixture was heated at 85°C for 6 hours to form an Up with NCO terminations. Then, Up was cooled to 60°C, and then THF, stabilizer and titanium dioxide (in Up7, DBA was added after cooling to 60°C) were uniformly mixed to form an Up solution. The NCO contents (% by weight, expressed in % in the table) of these Up solutions are shown in Table 1.

[0194] Preparation example

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Abstract

The present invention provides a material for slush molding which is improved in melt properties during slush molding and is excellent in heat resistance, the material being made up of a thermoplastic polyurethane resin (A) the difference between the softening starting temperature (STi) and the softening ending temperature by TMA being from 0 to 30° C., and STi being 135 to 200° C. The resin (A) has a hard segment with an Mn of 200 to 2000 comprising a diisocyanate having a symmetrical structure, a low molecular-weight diamine having a symmetrical structure, and / or a low molecular-weight diol, the content of which being from 5 to 50 wt %, and a soft segment making up of a high molecular-weight diol with an Mn of 500 to 5000, with the aromatic content being 35 wt % or less and the aromatic ring content x and the urea group content y satisfying <?in-line-formulae description="In-line Formulae" end="lead"?>-0.1x+2.5<=y<=-0.1x+6.<?in-line-formulae description="In-line Formulae" end="tail"?>

Description

technical field [0001] The present invention relates to a material for hollow molding, especially a material for hollow molding for automobile interiors. Background technique [0002] In the past, in order to improve the adhesion performance, washing resistance and dry cleaning resistance of the interlining, a hot-melt adhesive containing thermoplastic polyurethane resin was proposed. The difference and the softening start temperature are kept within a specific range, and the hot melt adhesive is also used as a material for hollow molding. (For example, see Japanese Patent No. 2984921.) [0003] However, for materials used in hollow molding, especially those suitable for the interior of automobiles, it is desired to satisfy conditions such as being able to obtain a molding material having excellent heat resistance and appearance, and having abrasion resistance. Focusing on polyurethane-based materials, no hollow molding material capable of satisfying these characteristics ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C41/00B29C41/18C08G18/12C08G18/28C08G18/32C08G18/65C08G18/66C08L75/04
CPCB29C41/18C08G18/2825C08G18/4277C08G18/6637C08L75/04C08G18/65C08G18/3206C08G2140/00C08G18/664C08G18/4202C08G18/0895C08G18/722C08G18/12B29C41/003C08G18/3256C08L83/00B60K37/00C08J3/20
Inventor 藤林慎也大森英树西冈尚吾竹内誉人野村真人
Owner SANYO CHEM IND LTD
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