Thermal-interface material and production thereof

Abstract

The invention comprises high molecular material and multi carbon nanotubes distributed in the high molecular materials. The thermal interface material forms first surface and second surface. The carbon nanotubes have opening at its both ends and is evenly distributed in the high molecular material, and extends into two surfaces along the first and second surface of thermal interface material. The invention also offers manufacturing method for the thermal interface material. It includes following steps: provides a carbon nanotube array that is soaked in fusion high molecule; solidifies the high molecule to generate high molecule composite material with carbon nanotube distribution; cuts the high molecule composite material to form the thermal interface material.

Description

【Technical field】 [0001] The invention relates to a thermal interface material and a manufacturing method thereof, in particular to a thermal interface material using carbon nanotubes for heat conduction and a manufacturing method thereof. 【Background technique】 [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, while the volume of devices has become smaller and smaller, and its heat dissipation has become an increasingly important issue. The requirements are also getting higher and higher. In order to meet these needs, various heat dissipation methods have been widely used, such as fan heat dissipation, water cooling auxiliary heat dissipation and heat pipe heat dissipation, etc., and a certain heat dissipation effect has been achieved. However, due to the uneven contact interface between the heat sink and the semiconductor integrated devic...

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Problems solved by technology

[0006] U.S. Patent No. 6,407,922 discloses a thermal interface material that utilizes the thermal conductivity of carbon nanotubes. It incorporates carbon nanotubes into a matrix material and then forms a thermal interface material by molding. The two components of the thermal interface material The area of ​​the heat conduction surface is not equal, and the area of ​​the heat conduction surface in contact with the heat sink is larger than the area of ​​the heat conduction surface in contact with the heat source, which can help the heat sink to dissipate heat, but the thermal interface material made by this method still has the following shortcomings, its First, it is difficult to make the thickness of the thermal interface material thinner by molding. Therefore, on the one hand, it leads to a decrease in the thermal conductivity of the thermal interface material, and on the other hand, it increases the volume of the thermal interface material, which is not conducive to the development of devices in the direction of miniaturization Second, the thermal interface material made by this method has disordered arrangement of carbon nanotubes in the matrix material, and it is difficult to ensure the uniformity of its distribution in the matrix material. , so the uniformity of heat conduction is also affected, and the advantages of longitudinal heat conduction of carbon nanotubes are not fully utilized, which affects the thermal conductivity of thermal interface materials

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