Semiconductor device producing method
A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of inability to obtain the reliability of insulating films, deterioration, degradation of semiconductor device performance and reliability, etc.
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no. 1 example
[0092] Hereinafter, referring to FIGS. 1(a) to (d) and FIGS. 2(a) to (c), a method of manufacturing a semiconductor device according to the first embodiment will be described.
[0093] First, as shown in FIG. 1(a), after a step layer 11 is formed on a substrate 10 made of a semiconductor wafer, a fluid substance, such as a liquid or gelatinous substance, is supplied to the step layer 11 to form a flow性膜12A. In addition, the planar shape of the substrate 10 is not particularly limited, and may be any shape such as a circular shape or a polygonal shape.
[0094]However, generally, in order to evaporate a part or most of the solvent in the fluid film 12A formed on the substrate 10, a heat treatment of about 80°C to 120°C is performed. This heating is generally referred to as pre-baking, and the temperature of the pre-baking may be set to such a degree that the fluidity of the fluid film 12A can be ensured in the planarization step performed next. That is, the temperature may be set a...
no. 2 example
[0113] Hereinafter, referring to FIGS. 1(a) to (d) and FIGS. 2(a) to (c), a method of manufacturing a semiconductor device according to the second embodiment will be described.
[0114] The basic processing sequence of the second embodiment is almost the same as that of the first embodiment, so the following description will focus on the differences from the first embodiment.
[0115] First, as in the first embodiment, after the step layer 11 is formed on the substrate 10, after the fluid film 12A is formed on the step layer 11, the pressing member 13 is pressed against the fluid film 12A to make the fluid film 12A The surface is flattened across the entire surface.
[0116] Next, by heating the fluid film 12A to the first temperature (T1) in a state where the pressing member 13 is pressed against the fluid film 12A, a cured film 12B having a flat surface is formed.
[0117] Next, after the pressing member 13 is detached from the cured film 12B, the cured film 12B is fired by heat...
no. 1 Embodiment
[0124] Hereinafter, with reference to Figs. 4(a) to (c), the first spin coating method, which is a method of forming the fluid film used in the first and second embodiments, will be described.
[0125] First, as shown in FIG. 4(a), after the substrate 21 is held by vacuum suction on the rotatable loading table 20, an appropriate amount of a liquid substance 23 is dropped on the substrate 21, and then the loading table 20 rotate, or as shown in FIG. 4(b), after the substrate 21 is held by vacuum suction on the rotatable loading table 20, while the loading table 20 is rotated to further rotate the substrate 21, the dropping nozzle 24 A substance 23 having fluidity is supplied onto the substrate 21.
[0126] In this way, as shown in FIG. 4(c), a fluid film 22 is formed on the substrate 21.
[0127] In either the method shown in FIG. 4(a) or the method shown in FIG. 4(b), by optimizing the viscosity of the fluidized substance 23 and the rotation speed of the loading table 20, it is poss...
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