Circuit device

Abstract

Provided is a circuit device capable of inhibiting an insulating layer from separating from a substrate. This circuit device comprises a substrate mainly constituted of metal including a first metal layer having a first thermal expansion coefficient, a second metal layer, formed on the first metal layer, having a second thermal expansion coefficient different from the first thermal expansion coefficient of the first metal layer and a third metal layer, formed on the second metal layer, having a third thermal expansion coefficient different from the second thermal expansion coefficient of the second metal layer, an insulating layer formed on the substrate, a conductive layer formed on the insulating layer and a circuit element electrically connected to the conductive layer.

Description

technical field [0001] The invention relates to circuit arrangements, in particular to circuit arrangements having circuit elements. Background technique [0002] In recent years, the heat generation density per unit volume has increased due to miniaturization, high density, and multifunctionalization of circuit devices included in electronic equipment and the like. Therefore, in recent years, as a substrate of a circuit device, a metal substrate having high heat dissipation is used, and an IC (Integrated Circuit: Integrated Circuit) or an LSI (Large Scale Integrated Circuit: Large Scale Integrated Circuit) is mounted on the metal substrate. circuit) and other circuit components. This is disclosed in, for example, JP-A-8-288605. Conventionally, there is also known a structure in which a hybrid IC (Hybrid Integrated Circuit: hybrid integrated circuit) is formed on a metal substrate. Here, a hybrid IC refers to a circuit device in which IC chips or circuit elements such as ...

AI Technical Summary

Problems solved by technology

[0005] However, in a conventional circuit device in which a resin layer (insulating layer) 102 and an IC chip 104 using a silicon substrate are formed on a metal substrate 101 made of aluminum (Al), the metal substrate 101 and the resin layer (insulating layer) exist. layer) 102 and IC chip 104 have a large difference in thermal expansion coefficient

As a result, there is a problem that the resin layer (insulating layer) 102 is easily peeled off from the metal substrate 101 due to the difference in thermal expansion coefficient between the metal substrate 101, the resin layer (insulating layer) 102, and the IC chip 104.

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