A sic/al with adjustable thermal expansion 2 (wo 4 ) 3 /al composites

A technology for composite materials and heat regulation, which is applied in the field of composite materials, can solve problems such as low density and obstacles to the development of composite materials, and achieve the effects of improving processing performance, reducing thermal expansion coefficient, and stabilizing properties

Active Publication Date: 2017-03-08
江苏时代华宜电子科技有限公司 +1
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AI Technical Summary

Problems solved by technology

[0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials, and composite materials for electronic packaging are generally used in a certain temperature-changing environment, so in this The thermal dimensional stability in the temperature range must be good, and the thermal expansion coefficient is a very important parameter; SiC / Al composite material is a new type of electronic packaging material, and its advantages are that the raw material is cheap and can be formed into complex shapes, and at the same time It has the characteristics of high thermal conductivity, high specific strength, high specific modulus, wear resistance, and low density. For SiC / Al composite materials, the most common method is to increase the content of reinforcement SiC to adjust the thermal expansion coefficient of the material. The thermal expansion coefficient of the composite material can be changed from that of aluminum to 23×10 -6 K -1 down to 7.5×10 -6 K -1 Around, material researchers have conducted a lot of research and reports on this, and the research results have also been applied in the field of electronic packaging; but SiC itself is a kind of high-hardness abrasive with high brittleness. The cutting performance of the SiC / Al composite material will be reduced, which has a great impact on the subsequent machining of the material, and hinders the development of SiC / Al composite materials; how to achieve low expansion, high thermal conductivity, and Performance stability and processability are the key issues to solve the practical application of such materials. The discovery of negative thermal expansion materials provides the possibility to solve such problems. At present, it is still very difficult to adjust the thermal expansion coefficient of composite materials by combining negative thermal expansion materials with Al matrix. rarely reported

Method used

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  • A sic/al with adjustable thermal expansion <sub>2</sub> (wo <sub>4</sub> ) <sub>3</sub> /al composites
  • A sic/al with adjustable thermal expansion <sub>2</sub> (wo <sub>4</sub> ) <sub>3</sub> /al composites
  • A sic/al with adjustable thermal expansion <sub>2</sub> (wo <sub>4</sub> ) <sub>3</sub> /al composites

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0026] Raw materials: Al powder, 40% by mass, SiC powder, 50% by mass, Al 2 (WO 4 ) 3 Powder, the mass ratio is 10%.

[0027] Take 0.5g of the above proportioned and uniformly mixed powder, fill it into a mold with a diameter of 10mm, and press it on a tablet press after vibrating and compacting at a pressure of 6MPa. After holding the pressure for 2 minutes, take a sample out of the mold; after the pressing is completed, put it into a vacuum tube Sintering is carried out in the furnace, and the vacuum furnace is heated at a heating rate of 5°C / min. When it rises to 600°C, it is kept for 3 hours, and the flow rate of the protective gas Ar is 1.5ml / s. 2 The flow rate is 0.3ml / s, cooling with the furnace.

[0028] The obtained sample is tested, and the thermal expansion curve is as follows: figure 2 As shown, the average coefficient of thermal expansion of the composite material in the range of 25 to 230°C is 8.6×10 through linear fitting calculation. -6 K -1 .

Embodiment 3

[0030] Raw materials: Al powder, 40% by mass, SiC powder, 40% by mass, Al 2 (WO 4 ) 3 Powder, the mass ratio is 20%.

[0031] Take 0.5g of the above proportioned and uniformly mixed powder, fill it into a mold with a diameter of 10mm, and press it on a tablet press after vibrating and compacting at a pressure of 6MPa. After holding the pressure for 2 minutes, take a sample out of the mold; after the pressing is completed, put it into a vacuum tube Sintering is carried out in the furnace, and the vacuum furnace is heated at a heating rate of 5°C / min. When it rises to 600°C, it is kept for 3 hours, and the flow rate of the protective gas Ar is 1.5ml / s. 2 The flow rate is 0.3ml / s, cooling with the furnace.

[0032] The obtained sample is tested, and the thermal expansion curve is as follows: image 3 As shown, the average thermal expansion coefficient of the composite material in the range of 25-230 °C is 7.7×10 -6 K -1 .

Embodiment 4

[0034] Raw materials: Al powder, 40% by mass, SiC powder, 30% by mass, Al 2 (WO 4) 3 Powder, the mass ratio is 30%.

[0035] Take 0.5g of the above proportioned and uniformly mixed powder, fill it into a mold with a diameter of 10mm, and press it on a tablet press after vibrating and compacting at a pressure of 6MPa. After holding the pressure for 2 minutes, take a sample from the mold; after pressing, put it into a vacuum tube Sintering is carried out in the furnace, and the vacuum furnace is heated at a heating rate of 5°C / min. When it rises to 600°C, it is kept for 3 hours, and the flow rate of the protective gas Ar is 1.5ml / s. 2 The flow rate is 0.3ml / s, cooling with the furnace.

[0036] The obtained sample is tested, and the thermal expansion curve is as follows: image 3 As shown, the average thermal expansion coefficient of the composite material in the range of 25 to 230°C is 4.9×10 -6 K -1 .

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Abstract

The invention belongs to the technical field of composite materials, and specifically relates to a SiC / Al2(WO4)3 / Al composite material with an adjustable thermal expansion. Al is used as a matrix; a low thermal expansion material SiC is used as a reinforcement; meanwhile, a certain amount of Al2(WO4)3 powder is added in for achieving a reduction of the thermal expansion coefficient. Al2(WO4)3 is a negative thermal expansion material that is able to resist a high temperature and is stable in property. On one aspect, Al2(WO4)3 is added in for reducing the thermal expansion coefficient of the original SiC / Al composite material; on the other aspect, Al2(WO4)3 is added in for reducing the content of the highly hard abrasive SiC and increasing the subsequent processing performance of the composite material. The SiC / Al2(WO4)3 / Al composite material with the adjustable thermal expansion is prepared by a powder metallurgy technology. The thermal expansion coefficient of the SiC / Al2(WO4)3 / Al composite material is significantly lower than that of the SiC / Al composite material. Accordingly, the requirement to the thermal expansion coefficient of electronic packaging materials is met better.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a SiC / Al material with adjustable thermal expansion 2 (WO 4 ) 3 / Al composite material, by changing the low thermal expansion material SiC and the negative thermal expansion material Al 2 (WO 4 ) 3 to adjust the thermal expansion coefficient of the composite material. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials, and composite materials for electronic packaging are generally used in a certain temperature-changing environment, so in this The thermal dimensional stability in the temperature range must be good, and the thermal expansion coefficient is a very important parameter; SiC / Al composite material is a new type of electronic packaging material, and its advantages are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/05C22C29/00B22F3/16
Inventor 程晓农张琰琰陈敏郭丽萍杨娟
Owner 江苏时代华宜电子科技有限公司
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