Panel assembling apparatus and panel assembling method

A technology for assembling devices and panels, applied in the manufacture of identification devices, instruments, discharge tubes/lamps, etc., can solve problems such as damage to sub-substrates, and achieve the effect of reliable transportation

Inactive Publication Date: 2006-05-31
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the holder of the above-mentioned discharge unit enters the lower side of the panel substrate connected to the sub-substrate placed on the transfer table, there is a possibility that the holder hits the sub-substrate hanging from the panel substrate and damages the sub-substrate.

Method used

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  • Panel assembling apparatus and panel assembling method
  • Panel assembling apparatus and panel assembling method
  • Panel assembling apparatus and panel assembling method

Examples

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Embodiment Construction

[0070] Before continuing to describe the present invention, it should be noted that in the drawings, the same reference signs are attached to the same components.

[0071] Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

[0072] figure 1 It is a perspective view showing the appearance configuration of the panel assembly device according to the embodiment of the present invention. According to the panel assembly device of this embodiment, the assembly figure 2 The shown device is used as a display 200 of a liquid crystal display, a plasma display, an organic EL display, or the like. Specifically, in a plurality of rectangular-shaped panel substrates 201 (in figure 2 3 among them) a device in which a sub-substrate 203 is assembled with a flexible substrate 202 at the edge. A sub-substrate 202 such as a TAB is bonded so as to protrude from the outer edge of the panel substrate 201 , and is supplied to t...

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Abstract

The present invention provides a panel assembly device and a panel assembly method. When bonding a panel substrate (201) and a sub-substrate (203) of a flexible substrate (202) by crimping and protruding, the panel substrate (201) and the sub-substrate (203) are placed on the panel mounting table (6) and the substrate mounting table (13), and the protruding part of the flexible substrate comes to the bonding position (204) of the sub-substrate (203), and the two loads are moved. set the stage, use the crimping head (15) to crimp the flexible substrate (202) and the sub-substrate (203), when the sub-substrate (203) that is crimped is removed from the substrate stage (13), the sub-substrate (203) is relatively The sub-substrate is directly supported from below by the supporting member (43) provided on the mounting base of the panel substrate so that the panel substrate (201) does not sag.

Description

technical field [0001] The present invention relates to a panel assembly device and a panel assembly method for bonding a sub-substrate to a panel substrate which is often used as a display of an electronic device. Background technique [0002] As displays of electronic devices such as computers and televisions, liquid crystal panels, plasma display panels (PDP), organic EL display panels, and the like have been widely used in recent years. The display has a transparent plate used as a panel substrate, a flexible substrate is bonded to the edge portion, and the outer leads of the flexible substrate are connected to electrodes of the sub-substrate to be assembled. As such flexible substrates, those manufactured using a film carrier by the TAB (Tape Automated Bonding) method are often used. [0003] In such a component assembly device, generally, the substrate for the panel on which the flexible substrate is mounted is placed on a transfer table, the sub-substrate is placed o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/18G02F1/13G09F9/00H05K1/14H05K13/00
CPCH01J9/241Y10T156/10Y10T156/1702H01J9/38H01J11/20
Inventor 中西智昭
Owner PANASONIC CORP
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