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Electronic component and method of manufacturing same

A technology of electronic components and electronic chips, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as no protection

Active Publication Date: 2006-05-31
VLSI TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current MRAM devices are electromagnetically shielded by depositing shielding layers on the top and bottom of such devices during the MRAM fabrication process, but current MRAM devices have no protection on the other four sides of such devices

Method used

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  • Electronic component and method of manufacturing same
  • Electronic component and method of manufacturing same
  • Electronic component and method of manufacturing same

Examples

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Embodiment Construction

[0015] In one embodiment of the present invention, an electronic component includes an electronic chip and a chip-carrying portion having sidewalls and a bottom. The electronic chip is installed above the bottom of the chip carrying part, and the chip carrying part shields the electronic chip from radiation from outside the electronic component.

[0016] Referring to the side sectional view that is a part of an electronic component according to an embodiment of the present invention figure 1 , the electronic component 100 includes a chip carrying portion 120 and an electronic chip 110 mounted therein. Chip housing portion 120 has sidewalls 121 and a bottom 122 and may be part of a lead frame, ceramic chip holder, grid array package, or some other chip carrying structure. Electronic component 100 may be a surface mount device, a leaded device, or the like.

[0017] In one embodiment, the height of the sidewall 121 of the chip carrying portion 120 may be substantially equal to...

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PUM

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Abstract

The electronic component disclosed in the present application includes an electronic chip (110) and a chip carrying part (120) having a side wall (121) and a bottom (122). The electronic chip is installed above the bottom of the chip carrying part, and the chip carrying part shields the electronic chip from radiation from outside the electronic component.

Description

technical field [0001] The present invention relates generally to electronic components, and more particularly to the packaging of electronic components. Background technique [0002] Random Access Memory (RAM) is used for data storage in almost all electronic devices. Various RAMs have been developed, including static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), magnetoresistive RAM (MRAM), and others. MRAM combines the high speed of SRAM with the high density of DRAM. This combination enables MRAM to store larger amounts of data, access it faster, and consume less power than other types of electronic memory. [0003] A metal is magnetoresistance if it exhibits a change in resistance when placed in a magnetic field. MRAM uses magnetic charges to store data instead of electric charges used by DRAM and SRAM. Therefore, to prevent memory loss, MRAM devices require thorough electromagnetic shielding. Current MRAM devices are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L23/04H01L23/495H01L23/552
CPCH01L23/49503H01L23/49506H01L23/552H01L2224/48091H01L2224/48247H01L2224/49171H01L2924/01078H01L2924/14H01L2924/3025H01L24/48H01L24/49H01L2224/05599H01L2224/45099H01L2224/85399H01L2924/00014H01L2924/181H01L2224/05554H01L2924/00H01L2224/45015H01L2924/207H01L2924/00012H01L23/60H01L23/02
Inventor 加里·约翰逊
Owner VLSI TECH LLC