Substrate treating apparatus

A kind of substrate processing equipment and substrate processing technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of pollution, increased cost, inconvenient installation space, etc., and achieve the goal of shortening the transportation path and effectively conveying Effect

Active Publication Date: 2006-07-19
日本网目版制造株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This creates the inconvenience and increased cost of larger installation spaces
Also, when transferring substrates between these substrate processing equipment, once the substrate moves out of a piece of equipment, it faces the possibility of being contaminated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] FIG. 1 is a schematic plan view of a substrate processing apparatus in Embodiment 1. FIG.

[0137] This substrate processing apparatus is configured to perform predetermined processing (eg, protective layer peeling processing) of a substrate or wafer W (eg, semiconductor wafer). The apparatus generally includes a cassette stage 1 for supporting cassettes C storing wafers W, a processing area 3 for performing predetermined processing of wafers W, and a transport for transferring wafers W provided between cassette table 1 and processing area 3. District 5. The processing block 3 has a first processing section 3a for processing many wafers W as a whole and a second processing section 3b for processing one wafer W at a time.

[0138] Each cassette C placed on the cassette stage 1 contains many (for example, 25) wafers W in a horizontal state and in multiple layers (hereinafter, many wafers W may be referred to as a group of wafers W where appropriate).

[0139] The transp...

Embodiment 2

[0196] Next, Embodiment 2 of the present invention will be described.

[0197] FIG. 9 is a schematic plan view of a substrate processing apparatus in Embodiment 2. FIG. The same reference numerals are used for the same parts as those in Embodiment 1, and their further descriptions are omitted.

[0198] The substrate processing apparatus in Embodiment 2 generally includes a cassette table 1 , a processing area 3 , a transport area 5 and an auxiliary transport area 9 . The auxiliary conveying zone 9 is arranged across the processing zone 3 opposite to the conveying zone 5 .

[0199] The auxiliary transfer area 9 is provided therein with a transfer mechanism 45 for transferring the wafer W to the second processing section and a second posture for receiving the wafer from the mechanism and changing the posture of the entire group of wafers between the horizontal posture and the vertical posture. A changer 61, a transfer mechanism 26 for transferring the group of wafers W to a fi...

Embodiment 3

[0221] Next, Embodiment 3 of the present invention will be described with reference to the drawings.

[0222] Figure 10 is a schematic plan view of the substrate processing apparatus in Embodiment 3.

[0223]The substrate processing apparatus in Embodiment 3 is designed to clean, etch and dry a wafer W (such as a semiconductor wafer), and includes containers for receiving seals (called FOUPs (Front Opening Unitary Containers), hereinafter Each container is used to store a plurality of wafers W, and includes a first processing area 103 for processing all of the plurality of wafers W, and a first processing area 103 for processing one wafer W at a time. A second processing area 105 , and a transfer area 107 for transferring the wafer W between the storage area 101 , the first processing area 103 and the second processing area 105 . Each integral container F corresponds to a container in the present invention. The storage area 101 , the first processing area 103 , the second ...

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PUM

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Abstract

A substrate treating apparatus includes a storage block for accommodating foups each storing a plurality of substrates, a first treating block for treating a plurality of substrates en bloc, a second treating block for treating one substrate at a time, and a transport device for transporting the substrates between the foups, first treating block and second treating block. The substrates may be treated in a mode of treating a plurality of substrates en bloc, and/or a mode of treating one substrate at a time.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for processing substrates such as semiconductor wafers, glass substrates for liquid crystal displays, etc. (hereinafter simply referred to as substrates). Background of the invention [0002] With regard to various types of substrate processing apparatuses, the processing method can be broadly classified into a batch method for processing many (for example, 25) substrates as a whole and a wafer-by-sheet method for processing one substrate at a time. [0003] In batch mode, a number of substrates being processed are all immersed in a processing solution stored in a processing tank. This mode has excellent mass production characteristics of substrate processing, and guarantees excellent mass production characteristics of substrate processing, and ensures uniform quality of substrate processing (as disclosed in Japanese Unexamined Patent Publication No. 2001-196342 ). [0004] In the shee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/00B08B3/00
Inventor 佐野谦一永见宗三光吉一郎酒井泷吉
Owner 日本网目版制造株式会社
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