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Plating method

A technology of substrate and composition, applied in liquid chemical plating, dielectric properties, coating, etc.

Inactive Publication Date: 2006-09-13
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The patent does not address optical substrates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] A 10 cm × 10 cm glass substrate was cleaned according to the following steps: contact with isopropanol for 5 min at 20 °C, rinse with cold water for 5 min at 20 °C, and rinse with tetramethylammonium hydroxide at 50 °C for 1 The wt% aqueous solution was contacted for 5 minutes, rinsed with cold water at 20°C for 4 minutes, and dried in an oven with compressed air (120°C, 10 minutes).

[0073] A liner composition comprising the following composition was prepared: 6% by weight of the general formula (C 6 h 5 SiO 1.5 )(CH 3 SiO 1.5 ) phenyl-methylsilsesquioxane oligomer, 0.5% by weight of siloxane-containing surfactant, and the balance being propylene glycol monomethyl ether acetate.

[0074] A tackifying composition comprising the following composition was prepared: 1% by weight of the general formula (C 6 h 5 SiO 1.5 )(CH 3 SiO 1.5 ) of phenyl-methylsilsesquioxane oligomers; 0.5% by weight of siloxane-containing surfactants; 20 g / L of palladium acetate as a plat...

Embodiment 2

[0078] The nickel plated samples prepared in Example 1 were then contacted with a commercial electrolytic copper plating bath (EP 1100, available from Rohm and Haas Electronic Materials) using the recommended plating conditions. After 2 minutes, the samples were removed from the plating bath and air dried. A layer of copper (approximately 125 nm thick) was deposited on the electroless nickel layer.

Embodiment 3

[0080] Repeat the process of Example 1. The electroless nickel plated samples were then contacted with a commercial electroless copper plating bath (Circuposit 880, available from Rohm and Haas Electronic Materials) using the recommended plating conditions. Copper was deposited on the nickel layer at a rate of 8-12 nm / min. The samples were removed from the plating bath, dried at 110°C for 10 minutes, and then annealed at 120°C for 60 minutes. This sample had an electroless copper layer deposited on an electroless nickel layer.

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Abstract

Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.

Description

technical field [0001] The present invention relates generally to the field of metal plating. In particular, the present invention relates to the field of forming metal films on non-conductive substrates. Background technique [0002] In the manufacture of electronic devices such as liquid crystal display ("LCD") devices, it is sometimes necessary to deposit metal thin films on substrates as electrodes or circuits. When the substrate has a complex surface topography, such as a curved surface or a three-dimensional surface, it is difficult to deposit a metal film. Additional difficulties arise when the substrate surface has grooves or cavities. Surface topography is often reflected on the metal film surface, causing grooves or voids in the metal film. [0003] These metal films are often deposited on non-conductive surfaces, such as optical substrates. Metal films are deposited using various techniques such as vacuum evaporation, sputtering, and chemical vapor deposition....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/20C23C18/31C25D5/56H05K3/00
CPCH05K2201/0116H05K2201/0236C23C18/1893H05K3/387C25D5/54C23C18/1851C23C18/2086C23C18/1651C23C18/1865H05K2201/0212C23C18/18C23C18/16
Inventor J·R·蒙塔诺J·A·里斯L·W·利特尔
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC