Method for electrically discharging substrate, substrate processing apparatus and program

Abstract

The present invention provides a substrate processing apparatus that executes electrical discharge processing before detaching a substrate held onto an electrostatic chuck of a lower electrode constituting a stage and undergoing a specific type of processing from the electrostatic chuck. Before electrically discharging the substrate, a decision is made as to whether or not the specific type of processing on the substrate has ended normally, and electrical discharge conditions are set based upon regular electrical discharge condition information stored at a regular electrical discharge condition information storage means if the substrate processing is judged to have ended normally, whereas electrical discharge conditions are set based upon non-regular electrical discharge condition information stored at a non-regular electrical discharge condition information storage means if the substrate processing is judged not to have ended normally. Then, under the electrical discharge conditions having been set, electrical discharge processing is executed on the substrate.

Description

technical field [0001] The present invention relates to a method for removing electricity from a substrate to be processed when the substrate to be processed is detached from a mounting table, a substrate processing apparatus, and a program. Background technique [0002] In a substrate processing apparatus that performs predetermined processes such as etching and film formation on a substrate to be processed such as a semiconductor wafer or a glass substrate, the substrate to be processed is carried into the processing chamber by a transfer arm, etc., placed on a stage and held by adsorption. The etching process is carried out in the state, and when the process is completed, for example, push to the lifting pin which can be lifted freely, so that the substrate to be processed is detached from the mounting table, and carried out by the transport arm or the like. [0003] At this time, as a jig for adsorbing and holding the substrate to be processed on the stage, for example, ...

AI Technical Summary

Problems solved by technology

Therefore, in order to remove the substrate to be processed in this state, even if the substrate to be processed is deionized, the deionization of the substrate to be processed cannot be sufficiently performed under the pre-stored destaticization conditions, and the substrate to be processed is prone to cutting damage. and offset

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