Pyramid-shaped capacitor structure and its manufacturing method

Abstract

A capacitor structure which has a generally pyramidal or stepped profile to prevent or reduce dielectric layer breakdown is disclosed. The capacitor structure includes a first conductive layer, at least one dielectric layer having a first area provided on the first conductive layer and a second conductive layer provided on the at least one dielectric layer. The second conductive layer has a second area which is less than the first area of the at least one dielectric layer. A method of fabricating a capacitor structure is also disclosed.

Description

technical field [0001] The present invention relates to a semiconductor element and a method for manufacturing the element, in particular to a pyramid-shaped capacitor structure in a semiconductor element, and a pyramid-shaped capacitor structure that is more resistant to edge breakdown (EdgeBreakdown) and its manufacture method. Background technique [0002] In the manufacture of semiconductor integrated circuits, metal conductor lines are used to interconnect (Interconnect) multiple components in the component circuits on the semiconductor wafer. The general process used to deposit metal conductor patterns on semiconductor wafers includes: depositing a conductive layer on a silicon wafer substrate; using standard lithography techniques to form a photoresist or other masks, such as titanium oxide or silicon oxide; subjecting the wafer substrate to a dry etching process to remove the conductive layer from areas not covered by the mask, leaving a masked metal layer in the fo...

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Problems solved by technology

[0010] It can be seen that the above-mentioned existing capacitor structure obviously still has inconvenience and defects in product structure, manufacturing method and use, and needs to be further improved urgently.

In order to solve the problems existing in the capacitor structure, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure for general products to solve the above problems. This is obviously a problem. Issues that relevant industry players are eager to solve

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