Semiconductor light emitting device and semiconductor light emitting unit

Abstract

In various aspects, a semiconductor light emitting device may include a mold resin having a cup shape portion on an upper surface of the mold resin; a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first lead section of the first lead, the second lead section of the first lead having a hole; a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section of the second lead; a light emitting element mounted on the second section of the first lead in the cup shape portion; a wire electrically connecting the light emitting element and the second lead; and a sealing resin configured to seal the light emitting element and the wire.

Description

technical field [0001] The present invention relates to a semiconductor light-emitting device and a semiconductor light-emitting assembly, in particular to a semiconductor light-emitting device and a semiconductor light-emitting assembly that require large current and high brightness to emit light for illumination or a backlight source of a liquid crystal display. Background technique [0002] In recent years, advances in technology can be expected as progress in white light-emitting LEDs utilizing phosphor ultraviolet light excitation and the like represents semiconductor light-emitting devices. As a result, applications such as lighting, backlights for liquid crystal displays, traffic signals, and displays for portable devices have been expanding. [0003] In addition, miniaturization and high-density mounting of devices are required at the same time, and surface mount devices (Surface Mount Device: SMD) are increasingly required. However, the surface mount type has conve...

AI Technical Summary

Problems solved by technology

Therefore, the heat dissipation is poor, and it cannot be driven by a large current

The second problem is that when integrating the heat sink and external terminals with a resin frame, it is necessary to position two or more metal parts in the molding die

This process is poor in productivity and high in cost

The third problem is that resin leakage, resin burrs, etc. may easily occur on the outer part of the resin frame.

[0008] On the other hand, due to the high thermal resistance of conventional surface-mounted semiconductor light-emitting devices, the upper limit of the driving current is about 50mA, and it is impossible to drive them with a large current.

In addition, the surface mount type is generally bonded by reflow soldering on a substrate with poor heat dissipation, so there are almost no measures related to the mounting method for good heat dissipation and the structure of the low thermal resistance semiconductor light emitting device.

Images