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Method and device for encapsulating electronic components using a flexible pressure element

A technology of electronic components and components, applied in the direction of electrical components, circuits, semiconductor devices, etc.

Active Publication Date: 2006-11-22
BESI NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with the disclosed method is that it only provides a solution for chips covered with encapsulant on the side opposite the chip surface which must remain free

Method used

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  • Method and device for encapsulating electronic components using a flexible pressure element
  • Method and device for encapsulating electronic components using a flexible pressure element
  • Method and device for encapsulating electronic components using a flexible pressure element

Examples

Experimental program
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Embodiment Construction

[0020] Figure 1A A (flip-chip) chip 1 is shown, which is connected to a carrier 3 via solder bumps 2 . The carrier 3 is placed in the mold part 4 such that one plane of the carrier 3 is fully supported by the mold part 4 . Placed in connection with the mold part 4 is the opposite mold part 5 which clearly forms a mold cavity 6 surrounding the chip 1 . The gel 7 (pressure distributor) is placed between the opposing mold part 5 and the chip 1, so that the gel 7 exerts a pressure on the chip 1, however, said pressure is limited so that the pressure exerted by the gel 7 Under the influence of pressure, the solder bump 2 is substantially not deformed. A recess 8 is provided in the opposing mold part 5 for positioning the gel.

[0021] exist Figure 1B , the mold cavity 6 enclosed by the mold part 4 and the opposing mold part 5 is filled with a liquid sealant 9 . The relatively high pressure on the encapsulant 9 also occurs in the space 10 between the chip 1 and the carrier 3 i...

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PUM

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Abstract

The present invention relates to a method of partially sealing a carrier assembly with connected electronic components with an encapsulant, comprising the steps of: A) enclosing and mounting at least a portion of the carrier between a mold part and an opposing mold part B) introducing a liquid encapsulant into the mold cavity, and C) removing the carrier with the sealed electronic component from the mold part after at least partially curing the encapsulant. The invention also relates to a device using this method.

Description

technical field [0001] The invention relates to a method according to the preamble of claim 1 for partially sealing a carrier assembly with connected electronic components with an encapsulant. The invention also relates to a device using the method according to the preamble of claim 6 . Background technique [0002] Sealing electronic components mounted on a carrier by means of an encapsulant is a common technique. Here, the carrier with the electronic components not yet encapsulated is typically clamped between two mold parts in such a way that a mold is formed around the electronic components for encapsulation (in particular, but not exclusively, semiconductor devices) cavity. The heated (liquid) sealing compound is then conveyed in the usual manner through the gate into the mold cavity by means of a plunger system, so that the mold cavity is filled with the sealing compound. After at least partial curing of the encapsulant, the mold part will be removed so that the car...

Claims

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Application Information

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IPC IPC(8): H01L21/56B29C45/14
CPCB29C45/14065B29C45/14639B29C45/14836B29C2045/14098H01L21/565H01L2224/16H01L2224/75315H01L2924/01005H01L2924/01006H01L2924/01033H01L2924/01082H01L2924/014H01L2924/181H01L2924/00H01L21/56
Inventor 弗朗西丝卡斯·B.·A.·德·维拉伊斯亨德拉卡斯·J.·B.·彼得斯
Owner BESI NETHERLANDS BV