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Mounting method of flexible circuit board

A flexible circuit board, flexible circuit technology, applied in the direction of circuit, electrical components assembly printed circuit, electrical components, etc.

Inactive Publication Date: 2006-11-29
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, in the cream solder printing using the method of identifying as a sheet, the position is recognized at two places in the transport jig, so it is the position of a plurality of other FPCs that are surface-mounted on one transport jig Printing in an uncertain state may cause problems in printing position

Method used

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  • Mounting method of flexible circuit board
  • Mounting method of flexible circuit board
  • Mounting method of flexible circuit board

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Embodiment approach 1

[0029] Figure 1 to Figure 8 It is a process chart which shows the process of Embodiment 1 of this invention in order. Figure 1A , Figure 1B It is a plan view showing a state where a plurality of FPC single sheets 1 are formed on an FPC sheet 2 . Usually, on the FPC sheet 2, a predetermined number of FPC single sheets 1 are arranged in a row. In the illustrated case, 12 FPC chips 1 are arranged in two rows and six columns.

[0030] On the FPC sheet 2, guide holes 3 are formed at four corners, and the alignment of the FPC sheet 2 is performed using the guide holes 3. FIG. The number of guide holes 3 is set to an appropriate number of two or more.

[0031] Figure 2A , Figure 2B It is a plan view and a side perspective view showing the state where the low-adhesion sheet 4 is mounted on the positioning jig 10 used in the present invention. Figure 2A in order to Figure 1A , Figure 1B The shown low-adhesion sheet 4 is turned upside down to show, Figure 2B , the state...

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Abstract

This invention provides a method for fixing monolithic of flexible circuit board onto conveying holding device. Prepare flexible circuit board (2) and low sticking plate (4), on the flexible circuit board monolithic (1) and inducting hole (3) at the regulated location are shaped, the low sticking plate has inducting hole (8) corresponding to the inducting hole (3) location, align the low sticking plate with the flexible circuit board, along with the monolithic figure cut the unnecessary part of the flexible circuit board, then remain the cut the monolithic on the low sticking plate, prepare conveying holding device (12) that bearing inducting hole and sticking layer, through the inducting hole, after the low sticking plate with taking the flexible circuit board monolithic butt-joint with the sticking layer of the conveying holding device, just remove the low sticking plate and the flexible circuit board monolithic is attached to the conveying holding device.

Description

technical field [0001] The present invention relates to a processing method for mounting a flexible circuit board (hereinafter referred to as FPC), and more particularly to a method of positioning and temporarily fixing the FPC to a delivery jig for component mounting. Background technique [0002] FPC, which is widely used with the increase in density of electronic circuits, has a soft structure and cannot directly mount parts. Therefore, a method is adopted in which the positioning accuracy is improved to a required level by pasting and fixing the parts to the metal plate and the resin plate for transportation (hereinafter referred to as the transportation jig), and then the installation work is performed. [0003] Conventionally, as shown in Japanese Patent Laid-Open No. 2002-314240 and Japanese Patent Laid-Open No. 2004-71863, the FPCs are positioned one by one by passing the guide pins of the transport jig through the guide holes provided in each FPC. And make it adher...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K3/34H01L21/68H01L23/498
Inventor 井上和夫
Owner NIPPON MEKTRON LTD