Laser processing method and device

Abstract

Displacement of a laser beam concentration point is reduced as much as possible, and simultaneously, laser processing is efficiently performed. A laser processing method has displacement acquiring steps (S07-S11). In the steps, a distance measuring laser beam for measuring the displacement of a surface (S1) of an object (S) to be processed is collected by a lens and irradiated to the object (S), and the displacement of a surface along a planned cutting line is acquired while the beam reflected by a main surface in correspondence to the irradiation is being detected (45). While the distance between an objective lens (42) for processing and the surface (S1) is being adjusted based on the displacement acquired in the displacement acquiring steps, the objective lens (42) for processing and the object (S) to be processed are relatively moved along the main surface to form a reformed region along the planned cutting line (P).

Description

technical field [0001] The present invention relates to a laser processing method and a laser processing device for processing an object to be processed by irradiating laser light. Background technique [0002] In the conventional laser processing technology, a measuring device (contact displacement meter, ultrasonic rangefinder, etc.) ) arranged in parallel at predetermined intervals (for example, refer to the following patent document 1 Figure 6 ~ Figure 10 ). In this laser processing technology, when the laser is scanned along the main surface of the object to be processed, the measuring device is used to measure the height of the main surface of the object to be processed. The surface height is measured by driving the condenser lens in the direction of its optical axis so that the distance between the condenser lens and the main surface of the object to be processed is constant. [0003] In addition, there is a technique for processing an object whose main surface has...

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