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Baling device for bread

A packaging device and panel technology, applied in packaging, transportation and packaging, and packaging of vulnerable items, can solve problems such as complex action adjustment, increased storage space, and low storage efficiency of glass substrates

Inactive Publication Date: 2007-03-28
HYMOLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the transportation efficiency will be reduced and the storage space will increase.
[0005] Furthermore, since the glass substrates are stored side by side in the panel transport box in a state where the main surfaces of the glass substrates are perpendicular to each other at a distance between the grooves, it is complicated and difficult to adjust the operation when inserting the glass substrates into the storage box and when taking the glass substrates out. The problem
When the pitch of the holding grooves is reduced to improve the storage efficiency of the glass substrates, the gap between the adjacent glass substrates becomes narrow, thereby narrowing the space for inserting and inserting the tools for inserting and removing the glass substrates. This makes handling the glass substrate more difficult
[0006] Furthermore, since the storage efficiency of the glass substrates in the internal space is low, the size of the glass transfer box for storing a predetermined number of glasses increases, thereby increasing the size of the molding machine and increasing the manufacturing cost.
Furthermore, since the volume of the panel transport box becomes larger, the amount of resin raw material used increases
In addition, it is difficult to maintain the dimensional accuracy in the forming process, so there are problems such as deterioration of the forming yield.

Method used

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Embodiment Construction

[0046] Hereinafter, the invention of the present application will be described by means of illustrated embodiments. 1 to 7 show the overall shape of the panel packaging device according to the present embodiment, and particularly show the state in which the panels are packaged. As shown in FIG. 1 , the packing device includes a main body 10 composed of a flat box. Moreover, the upper part of the main body 10 becomes the opening 11, and the cover body 12 is detachably attached so that this opening 11 may be closed. The glass substrate 15 is housed in the main body 10 in a state of being overlapped with the foam plate 16 . The cover body 12 is attached and bound by the strap 20 attached to the main body 10 . A hook-side nylon fastener 21 and a loop-side nylon fastener 22 are attached to both ends of the belt 20 .

[0047] The main body 10 of this packing device is a flat box with an opening 11 at the top as shown in FIGS. 8 to 13 . Such a box can be made of, for example, a f...

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PUM

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Abstract

There is provided an apparatus for packing panels for carrying and storing glass substrates with high conveyance efficiency while protecting them from external shocks or the like. The glass substrates 15 are stacked alternately with foamed sheets 16 and stored in a recess 25 of a body 10 so that principal planes of the substrates 15 are approximately parallel to the bottom surface of the body 10. In doing so, the glass substrates 15 are stored so that their peripheral edges are supported by protrusions 27 formed on the inner surface of peripheral walls of the body 10. An upper opening 11 of the body 10 is pressed by a lid 12. Bands 20 passing through insertion holes 34 of the body 10 are extended over the lid 12, and Velcro(R) fasteners 21 and 22 at both ends of the bands 20 are engaged with each other to fasten the lid 12.

Description

technical field [0001] The present invention relates to a panel packaging device, in particular to a panel packaging device in which a storage space is formed inside and a plurality of panels are stacked and stored substantially parallel to the bottom. Background technique [0002] In order to assemble a liquid crystal display device, a glass substrate is used, and various processes need to be performed on the glass substrate. According to needs, unprocessed substrates or glass substrates in process must be transported. In order to meet the demand for transporting such glass substrates, a panel transport box as disclosed in JP-A-2004-323107 has been proposed. [0003] This panel transfer box is composed of a main body, a bottom plate and a cover body, and the main body is composed of two long-side side panels and two short-side side panels, and is composed of three upper and lower straps extending laterally ( band) to combine these side panels with the bottom panel. Theref...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/127B65D85/48
Inventor 进藤洋和山下胜彦坂口和也
Owner HYMOLD