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Non-destructive testing apparatus and non-destructive testing method

A technology of inspection device and inspection method, which is applied in non-contact circuit testing, electronic circuit testing, semiconductor/solid-state device testing/measurement, etc., to achieve the effect of shortening the acquisition time and scanning time

Inactive Publication Date: 2011-09-07
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the OBIC method, the observation is made between two terminals, and in this way the OBIC generation path is limited

Method used

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  • Non-destructive testing apparatus and non-destructive testing method
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  • Non-destructive testing apparatus and non-destructive testing method

Examples

Experimental program
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Effect test

Embodiment 1

[0032] The non-destructive inspection device and the non-destructive inspection method based on the light scanning method of the present invention will be described with reference to the drawings. figure 1 It is a basic principle diagram for explaining the application of the light scanning method of the present invention to Embodiment 1 in the OBIRCH method. figure 2 (A) is a plan view of the inspected body 1 with a defect 8 and a comparison diagram of the first and second one-dimensional images 13, 14 obtained by using the light scanning method of the present invention, and (B) is the obtained first and A comparison diagram of the second one-dimensional images 13, 14 and the two-dimensional image 15 obtained through calculations based on this.

[0033] In the OBIRCH method of Example 1 to which the light scanning method of the present invention is applied, the voltage source 5 and the fluctuating current detection unit 6 are connected between the two terminals of the electronic ...

example 1

[0043] Figure 5 It is a schematic diagram for explaining the observation result when both condition 1 and condition 2 are satisfied. That is, the fault location is one point, the signal detection sensitivity is constant, and the example of the present invention is most easily applied. Figure 5 (A) is a comparison diagram of the two-dimensional image 29 obtained by the existing method on the subject and the first and second one-dimensional images 13, 14 obtained by the method based on the present invention. Figure 5 (B) is a comparison diagram of the first and second one-dimensional images 13, 14 obtained by the method based on the present invention and the two-dimensional image 15 obtained by calculation. The present invention is applied to the OBIRCH method, the RIL method, or the SDL method, and the high resistance position of the via part of the wiring system on the LSI chip of the subject 1 is detected, which is the most advanced among the current LSI chips This correspon...

example 2

[0048] Image 6 It is a schematic diagram for explaining the observation result when condition 2 is satisfied but condition 1 is not satisfied. Image 6 (A) is a comparison diagram of the two-dimensional image 29 obtained by the conventional method on the subject 1 and the first and second one-dimensional images 13 and 14 obtained by the method based on the present invention. Image 6 (B) is a comparison diagram of the first and second one-dimensional images 13, 14 obtained by the method based on the present invention and the two-dimensional image 15 obtained by calculation. For example, the detection of the abnormal path of the wiring current on the LSI chip corresponds to this case, which is one of the most defective cases among the most advanced LSI chips at present. Because condition 1 is not met, it takes a lot of effort to determine the location of the fault, but the total analysis time can be shortened compared with existing methods.

[0049] Reference Image 6 (A). On the ...

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Abstract

A non-destructive testing method of improved efficiency. Two one-dimensional images are obtained by scanning an optical line over an object to be tested in an X- and Y-directions each for one scan in lieu of conducting a prior art method of two-dimensionally scanning a optical spot on the object to be tested. A two-dimensional image is reconstructed from the obtained two one-dimensional images. Since only two relative scans between the object to be tested and the optical line is necessary, scanning time is remarkably shortened in comparison with that of the prior art.

Description

Technical field [0001] The present invention relates to a non-destructive inspection device and a non-destructive inspection method of an object to be inspected, and more particularly to a non-destructive inspection device and a non-destructive inspection method suitable for inspecting defects of semiconductor devices. Background technique [0002] An OBIRCH (Optical Beam Induced Resistance CHange) method is known as a conventional non-destructive inspection method for electronic components (subjects) such as semiconductor chips. In the OBIRCH method, a laser is used to scan a semiconductor chip while forming an image of the change in wiring resistance when heat is applied to the wiring. According to this method, it is possible to visualize the wiring with current flowing, and because the temperature rise is different between the positions where there are defects such as voids and the positions where there are no defects, the defects can be identified on the image (refer to Non-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/72H01L21/66
CPCG01R31/311
Inventor 二川清
Owner RENESAS ELECTRONICS CORP