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Substrate inspection method, printed-wiring board, and electronic circuit device

A technology for inspection of printed circuit boards and substrates, which is applied in the fields of printed circuit, printed circuit, and printed circuit manufacturing, and can solve problems such as difficult cross-sectional observation and X-ray inspection applications

Active Publication Date: 2007-06-27
TOSHIBA CLIENT SOLUTIONS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus there is a problem that it is difficult to apply cross-sectional observation and X-ray inspection to product testing during the production process

Method used

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  • Substrate inspection method, printed-wiring board, and electronic circuit device
  • Substrate inspection method, printed-wiring board, and electronic circuit device
  • Substrate inspection method, printed-wiring board, and electronic circuit device

Examples

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Embodiment Construction

[0020] Various embodiments according to the present invention will be described below with reference to the accompanying drawings.

[0021] When heating a printed wiring board having a blind via, if there is a defective portion such as a crack, a pinhole, a plating defect in the blind via, gas in a base material including an insulating material passes through the defect Partial outflow. One embodiment of the present invention is intended to capture and use the gas flowing out into the blind vias to easily detect defects in the blind vias that are overlooked in conductivity testing.

[0022] FIG. 1 shows a part of components implementing a substrate inspection method, a printed wiring board, and an electronic circuit device according to one embodiment of the present invention.

[0023] In FIG. 1, a printed wiring board 10 forms a build-up multilayer wiring board. Many circuit patterns, through holes, blind via holes, solder pads, pads, etc. are formed in the surface layer and...

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PUM

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Abstract

According to one embodiment, there is provided a substrate inspection method including forming a film over an opening portion of a blind via hole formed in a printed-wiring board, and heating the printed-wiring board. Based on a variation in the shape of the film, it is possible to determine a defective blind via hole.

Description

technical field [0001] An embodiment of the present invention relates to a substrate inspection method, a printed wiring board, and an electronic circuit device, which are applied to quality control of a substrate having blind via holes. Background technique [0002] A printed wiring board having a multilayer structure called a laminated wiring board is used for electronic circuit devices such as personal computers. Many blind vias are used in printed wiring boards. A blind via is formed by making a hole in the surface layer by, for example, laser irradiation, plating the hole, and combining the pattern on the surface layer with the inner layer pattern. In order to achieve stable operation of the product, the conductivity of the blind vias must be maintained by adequate plating. [0003] Regarding the quality control technique of printed wiring boards with blind vias, there is a technique for confirming the above-mentioned electrical conductivity by attaching a test board ...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/00G06F1/00G01N27/04G01R31/02
CPCH05K2203/162H05K3/421H05K2203/1394H05K2203/1178H05K2201/09509H05K3/3494H05K2201/091
Inventor 长谷川健治
Owner TOSHIBA CLIENT SOLUTIONS CO LTD
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