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Self-alignment features for III-V ridge process and angled facet die

a self-aligning feature and ridge technology, applied in the direction of lasers, semiconductor lasers, electrical instruments, etc., can solve the problems of misalignment of assembled components, ineffective alignment and packaging techniques,

Active Publication Date: 2019-11-26
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach enables high-accuracy three-dimensional alignment of package components, eliminating the need for tolerance requirements in laser manufacturing and ensuring precise engagement between the laser and photonics chips, enhancing the reliability of flip-chip assembly.

Problems solved by technology

However, such alignment and packaging techniques can be ineffective to accurately align package components due to various tolerances that exist in certain fabrication and assembly processes.
Such variations in chip sizes and placement can result in misalignment of assembled components when using mechanical stops and solder reflow techniques for alignment.

Method used

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  • Self-alignment features for III-V ridge process and angled facet die
  • Self-alignment features for III-V ridge process and angled facet die
  • Self-alignment features for III-V ridge process and angled facet die

Examples

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Embodiment Construction

[0013]Detailed embodiments of the claimed structures and methods are disclosed herein; however, it is to be understood that the disclosed embodiments are merely illustrative of the claimed structures and methods that may be embodied in various forms. In addition, each of the examples given in connection with the various embodiments are intended to be illustrative, and not restrictive. Further, the figures are not necessarily to scale, some features may be exaggerated to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the methods and structures of the present disclosure.

[0014]References in the specification to “one embodiment”, “an embodiment”, “an example embodiment”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodim...

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PUM

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Abstract

A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.

Description

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT[0001]This invention was made with Government support under DE-AR0000540 awarded by the department of energy. The Government has certain rights in this invention.BACKGROUNDTechnical Field[0002]This disclosure generally relates to the assembly of microelectronic, photonic and optoelectronic devices.Description of the Related Art[0003]Assembling flip-chip package structures typically utilize lithographically defined mechanical stops in conjunction with a solder reflow process to align components in one or two dimensions. However, such alignment and packaging techniques can be ineffective to accurately align package components due to various tolerances that exist in certain fabrication and assembly processes. Such variations in chip sizes and placement can result in misalignment of assembled components when using mechanical stops and solder reflow techniques for alignment.SUMMARY[0004]In one embodiment, a method of forming ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01S5/022H01S5/22H01S5/042H01S5/0238
CPCH01S5/0224H01S5/02268H01S5/02252H01S5/0425H01S2301/176H01S5/22H01S5/02272H01S5/04252H01S5/02375H01S5/0234H01S5/0237H01S5/02345H01S5/0238H01S5/02326
Inventor BARWICZ, TYMONMARTIN, YVES C.ORCUTT, JASON S.
Owner INT BUSINESS MASCH CORP