Optically and electrically programmable silicided polysilicon fuse device

Inactive Publication Date: 2003-02-06
KOTHANDARAMAN CHANDRASEKHARAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0034] Another object of the present invention is to provide programmable fuse links for use in integrated circuits that, unlike all currently known methods of programming, are free from physical damage to the structure.
[0035] A further object of the present invention is to provide programmable fuses for use in integrated circuits that utilize less energy in comparison to ablation or melting techniques, and that reduces the pitch and damage to nearby structures upon programming.
[0036] A yet further object of the present invention is to provide programmable fuses for use in integrated circuits that are capable of being programmed by optical means, of shorter wavelengths, and thereby reducing the focal spot size of the optical beam that lead to reduced pitch, but which also lends itself to being electrically programmed as well as optically programmed.

Problems solved by technology

In general, today, integrated circuits are made with internal connections that are set during manufacturing; however, due to high development costs, lengthy lead times, and the high tooling costs of these circuits, the end user prefers circuits which can be programmed in the field.
Some of the key disadvantages of fusible link PROM systems is that, because of the nature of the conducting material in the link, high voltage and high current levels are usually needed during programming in order to complete blowing of the fusible link.
Because the link is relatively high in conductance, it requires a considerable amount of power dissipation to blow it.

Method used

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  • Optically and electrically programmable silicided polysilicon fuse device
  • Optically and electrically programmable silicided polysilicon fuse device
  • Optically and electrically programmable silicided polysilicon fuse device

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Embodiment Construction

[0042] Reference is now made to FIG. 1 which shows a microphotograph of a fuse link, wherein metal lines on oxide / low dielectric constant materials evidence a splatter formed by the high energy needed to program this fuse. When programming similar fuse links found in the prior art, a large pitch is needed and this is another disadvantage attendant to the use of this fuse link. Further disadvantages associated with the large pitch that is needed for programming in the prior art fuse link is the damage caused to the layers beneath the fuse, and that the fuses are isolated in a fuse box (and this causes an area penalty). Additionally, there are complications in back-end integration--such as flip chip bonding--when utilizing this prior art poly-Si based fuse link.

[0043] A still further disadvantage in addition to the splatter created from high energy when programming the prior art fuse link is that cracks 11 are created upon programming, as can be seen in the microphotograph of FIG. 2.

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Abstract

A silicided polysilicon based fuse device that is programmable by optical and electrical energy in the polysilicon layer without damage to nearby structures, comprising: a Si substrate; an insulating layer disposed on the substrate; and a fuse device section comprising poly-Si / a silicide / and a barrier layer, the fuse device section forming an electrical discontinuity in the poly Si layer in response to an electrical pulse or an optical pulse applied to it.

Description

[0001] 1. Field of Invention[0002] The invention relates to integrated circuit devices, and more particularly, to fusible link devices in semiconductor integrated circuits in which the laser fuse is made in the poly-Si level, as opposed to the metal level, which can be placed in oxide.[0003] 2. The Prior Art[0004] In general, today, integrated circuits are made with internal connections that are set during manufacturing; however, due to high development costs, lengthy lead times, and the high tooling costs of these circuits, the end user prefers circuits which can be programmed in the field. These circuits are typically referred to as programmable circuits since they usually contain programmable links.[0005] Programmable links are electrical interconnects which are broken or created at selected electronic nodes by the end user after the integrated circuit device has been fabricated in order to activate or deactivate the selected electronic nodes.[0006] As a case in point, programmab...

Claims

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Application Information

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IPC IPC(8): H01L23/522H01L23/525H01L23/532H01L23/66
CPCH01L23/5222H01L23/5256H01L23/5258H01L23/5329H01L23/66H01L2924/0002H01L2924/3011H01L2924/00
InventorKOTHANDARAMAN, CHANDRASEKHARAN
OwnerKOTHANDARAMAN CHANDRASEKHARAN