Leadframe and method of manufacturing the same
a technology of lead frame and manufacturing method, which is applied in the field of lead frame, can solve problems such as raising the product cos
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embodiment 1
[0024]FIG. 1 is a flowchart illustrating an embodiment of the manufacturing method of leadframe according to the present invention. In the FIG. 1, 1 is a plate of copper or similar material for forming a leadframe. 2 is a dry film mounted on the front and back surface of the metal plate 1. 3 is a glass mask which is put on the dry film 2 placed on the surface of the metal plate 1, and which forms a leadframe pattern 3a by using a light shielding agent. 4 is a glass mask which is put on the dry film 2 placed on the back surface of the metal plate 1, and which forms a leadframe pattern 4a on symmetrically opposite side to the leadframe pattern 3a with respect to the metal plate 1 by using the light shielding agent. 5 and 6 are glass masks which form predetermined shading patterns, and 7 are a plurality of etching liquid injection nozzles which are disposed oppositely at both sides of the metal plate 1.
[0025] Next, the manufacturing process of the leadframe will be explained in turn. ...
embodiment 2
[0031]FIG. 2 shows a flowchart illustrating another embodiment of the manufacturing method of leadframe according to the present invention. In FIG. 2, the same reference numerals in FIG. 1 are used to the substantially same components and portions, the explanation of the reference numerals are omitted. Since each process shown in FIGS. 2A, 2B, 2C and 2D is the same as each process shown in FIGS. 1A, 1B, 1C and 1D as it is clearly seen by comparison with FIG. 1, the explanation of such process is omitted, with respect to each process shown after FIG. 2E, the explanation will be made.
[0032] As shown in FIG. 2E, the etching is carried out by spraying the etching liquid through the injection nozzles 7 to the both sides of the metal plate 1 with the plated layer la. Such etching is carried out until the metal of the portion where the plating is not carried out becomes extremely thin in consequence of such metal having been almost dissolved and removed.
[0033] After a tape 8 is attached,...
embodiment 3
[0034]FIG. 3 shows a flowchart illustrating still another embodiment of the manufacturing method of leadframe according to the present invention. In FIG. 3, the same reference numerals in FIG. 1 are used to the substantially same components and portions, the explanation of those numeral references is omitted. Since each process shown in FIGS. 3A and 3B is the same as the process shown in FIGS. 1A and 1B as it is clearly seen in comparison with FIG. 1, the explanation of such processes is omitted, with respect to each process shown after FIG. 3C, the explanation will be made.
[0035] As shown in FIG. 3C, the etching is carried out by spraying the etching liquid through the injection nozzles 7 on both sides of the metal plate 1 on which the dry film 2 remains corresponding to the leadframe pattern. Such etching is carried out until the metal plate 1 comes to have penetrated holes as a consequence of dissolution and removal of the metal of portions on which the dry film 2 do not exist, ...
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