Copper strike plating bath

Inactive Publication Date: 2006-02-09
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0015] In the copper strike plating bath of the present invention, a conductive salt has a buffering action. Accordingly, there is decreased fluctuation in the pH during plating work, and the bath can be easily controlled. In addition, since the bath has high electrical conductivity, high anode-cathode polarizability and high current density, the use of the copper strike plating bath of the present invention makes it possible to improve macrothrowing power, or in other words, realize uniform plating deposition regardless of the shape of the plated material. In addition, since there are no large fluctuations in current efficiency caused by fluctuations in cyanide concentration as in cyanide baths of the prior art, the copper strike plating bath of the present invention can be easily controlled. Moreov

Problems solved by technology

However, since plating current efficiency is greatly affected by changes in cyanide ion concentration in the bath, control of cyanide baths is difficult.
Since cyanide compounds are toxic, they are not desirable in terms of waste water treatment and the environment.
Although copper sulfate baths are also used as strike plating baths that do not use cyanide as described

Method used

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  • Copper strike plating bath

Examples

Experimental program
Comparison scheme
Effect test

Example

Comparative Example 1

[0025]Potassium copper cyanide185g / LPotassium cyanide10 to 80g / L

[0026] When current efficiency was measured during copper strike plating under conditions of 50° C. and 8 A / dm2 onto an iron-nickel alloy material in a copper strike plating bath having the above composition (the cyanide concentration changes according to the amount of potassium cyanide), it fluctuated from 10 to 90% depending on the cyanide concentration. In addition, the pH of the bath fluctuated from 9 to 12 depending on the cyanide concentration.

Example

Comparative Example 2

[0027]Potassium copper cyanide80 g / LPotassium cyanide30 g / L

[0028] When current efficiency was measured during copper strike plating within a current density range of 3 to 12 A / dm2 at 50° C. onto a copper alloy material in a copper strike plating bath having the above composition, current efficiency was 10% or less.

Example

Comparative Example 3

[0029]Potassium copper cyanide190 g / LPotassium cyanide 30 g / L

[0030] When current efficiency was measured during copper strike plating under conditions of 50° C. and 8 A / dm2 onto a copper alloy material in a copper strike plating bath having the above composition, current efficiency was 50%.

[0031] Moreover, when copper plating was carried out at a thickness of 0.2 μm onto an iron-nickel alloy material using this bath, the resulting plating demonstrated a uniform, semi-bright appearance. When this test piece was heated on a hot plate at 400° C., adhesion was satisfactory and heating blisters were not formed. In addition, when the same heating test was carried out on a test piece subjected to copper strike plating at a thickness of 0.1 μm followed by silver plating at a thickness of 5 μm, there was no occurrence of discoloration, blistering or peeling of the silver plating.

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Abstract

A copper strike plating bath comprising a copper cyanide compound and one or more of salts of inorganic acids and salts of organic acids. The copper cyanide compound is preferably sodium copper cyanide, potassium copper cyanide or a mixture thereof.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a copper strike plating bath used for pretreating materials when plating copper-based or iron-based materials. [0003] 2. Description of the Related Art [0004] Cyanide baths have conventionally been used to carry out copper strike plating on a plated material with satisfactory adhesion. For example, JP 11-274177 A describes the use of a copper strike plating bath comprising a mixture of sodium cyanide and copper cyanide when producing a lead frame by carrying out copper strike plating and partial silver plating. [0005] In addition to being able to carry out plating with satisfactory adhesion on iron-based materials as well without dissolving the material, since the deposition potential of cyanide baths is sufficiently negative, they have superior characteristics along with surface activating effects accompanying hydrogen generation on a cathode surface. However, since plating current ...

Claims

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Application Information

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IPC IPC(8): C25D3/40
CPCC25D5/34C25D3/40C25D3/38
Inventor OGIHARA, YOKONAKAZAWA, MASAO
Owner SHINKO ELECTRIC IND CO LTD
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