Structure of joining resin molded bodies
Patent Information
- Authority / Receiving Office
- US ยท United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- DAIKYONISHIKAWA CORP
- Publication Date
- 2006-03-30
- Estimated Expiration
- Not applicable ยท inactive patent
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Abstract
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a joining structure of resin molded bodies by means of a vibration welding method while applying a pressure to the pair of resin molded bodies in a state in which joining parts of the pair of resin molded bodies are butted into each other across a substantially entire area of the joining parts.
[0003] 2. Description of the Related Art
[0004] Conventionally, as a generally known method of joining a pair of resin molded bodies is available a so-called vibration welding method, in which a vibration is applied to the resin molded bodies in a state in which joining parts of the pair of resin molded bodies are butted into each other and pressurized so that the pair of resin molded bodies are joined with each other.
[0005] However, it is a publicly known problem in joining the resin molded bodies with each other by means of the vibration welding method that it is quite difficult to obtain a...