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Scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheel

a technology of scribing apparatus and cutter wheel, which is applied in the direction of paper/cardboard containers, box making operations, manufacturing tools, etc., can solve the problems of no commercial value as liquid crystal panels, defects (horizontal cracks) may be caused, and cracks may form

Inactive Publication Date: 2009-05-21
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, cracks may be formed so as to be in contact with each other so that defects (horizontal cracks) are caused at that position of contact.
A bonded glass substrate having such a separation face extending along an oblique direction, or such defects, has no commercial value as a liquid crystal panel.
However, the actual size of the grooves is a size of the micron order, which is not perceptible by a human eye.
However, since precise undulations are formed along the entire perimeter of the edge line portion of the glass cutter wheel 5, the process and formation of the undulations in the edge line portion requires a long process time, and there are some problems in processibility.

Method used

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  • Scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheel
  • Scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheel
  • Scribing method, a cutter wheel, a scribing apparatus using the cutter wheel, and an apparatus for producing the cutter wheel

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0082]FIG. 10 shows an embodiment of a glass cutter wheel of Example 1. TABLE 2 below shows dimensions of the glass cutter wheel of Example 1, such as a wheel diameter or the like.

TABLE 2Wheel diameter φ2.0 mmWheel thickness w0.65 mmBlade edge angle α135°Depth of groove7 μm

[0083]The glass cutter wheel 6 of Example 1 was designed such that grooves having identical depths (7 μm) are continuously formed over a 1 / 10 portion (8 divisions / 80 divisions) of the entire perimeter length of the edge line portion.

[0084]This glass cutter wheel 6 was used to scribe an alkali-free glass plate having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and at a scribing speed of 400 mm / s. In the scribing process using the glass cutter wheel 6 of Example 1, a scribe line where the depth of a vertical crack periodically varies was formed as shown in FIG. 7. In the case where a load of 0.18 MPa was used, the deep vertical crack DA shown in FIG. 7 was about 400 μm, and the shallow vertical ...

example 2

[0085]FIG. 11 shows an embodiment of a glass cutter wheel 6 of Example 2. TABLE 3 below shows dimensions of the glass cutter wheel shown in FIG. 11, such as a wheel diameter or the like.

TABLE 3Wheel diameter φ2.0 mmWheel thickness w0.65 mmBlade edge angle α135°Depth of groove7 μm

[0086]The glass cutter wheel 6 of Example 2 has regions A1 and A2 at two separated positions in the perimeter of the glass cutter wheel 6, each of which is a 1 / 10 portion (8 divisions / 80 divisions) of the entire perimeter length of the edge line portion, where grooves having identical depths (7 μm) are continuously formed. Regions A1 and A2, where grooves are formed, are provided at opposite sides of the glass cutter wheel 6 with respect to the central axis of the glass cutter wheel 6.

[0087]This glass cutter wheel 6 was used to scribe an alkali-free glass plate having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and at a scribing speed of 400 mm / s. In the scribing process using the glass ...

example 3

[0088]FIG. 12 shows an embodiment of a glass cutter wheel 6 of Example 3. TABLE 4 below shows dimensions of the glass cutter wheel 6 of Example 3, such as a wheel diameter or the like.

TABLE 4Wheel diameter φ2.0 mmWheel thickness w0.65 mmBlade edge angle α135°Depth of groove7 μm

[0089]The glass cutter wheel 6 of Example 3 has regions A1, A2, and A3 at three separated positions in the perimeter of the glass cutter wheel 6, each of which is a 1 / 10 portion (8 divisions / 80 divisions) of the entire perimeter length of the edge line portion, where grooves having identical depths (7 μm) are continuously formed. Regions A1, A2, and A3 are provided at uniform intervals.

[0090]This glass cutter wheel 6 was used to scribe an alkali-free glass plate having a thickness of 0.7 mm with a blade edge load of 0.16 to 0.40 MPa and at a scribing speed of 400 mm / s. In the scribing process using the glass cutter wheel 6 of Example 3, a scribe line where the depth of a vertical crack periodically varies was ...

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Abstract

In a glass cutter wheel where a blade edge is formed on a disk-shaped wheel, grooves having a predetermined shape are formed at a predetermined pitch in a 1 / 4 or smaller or 3 / 4 or smaller blade edge line portion of the entire perimeter of the blade edge. The ratio of the groove portion to the entire perimeter, which largely contributes to a scribing characteristic, is changed such that a desired scribing characteristic can be obtained.

Description

[0001]This application is a divisional of U.S. patent application Ser. No. 10 / 468,754 filed on Aug. 22, 2003, which is hereby incorporated herein by reference in its entirety.TECHNICAL FIELD[0002]The present invention relates to: a scribing method of forming a scribe line for separating a brittle material; a cutter wheel, which is a scribe cutter used for forming a scribe line in a brittle material; a scribing apparatus incorporating such a cutter wheel; and a cutter wheel production apparatus for producing such a cutter wheel.[0003]The brittle material includes glass, used for a glass substrate or a bonded glass substrate, a semiconductor wafer, ceramics, etc.BACKGROUND ART[0004]FIGS. 1(a) through 1(d) are cross-sectional views for illustrating a first separation method of a liquid crystal mother substrate in a step-by-step manner as an example of a conventional procedure for cutting a bonded glass substrate, such as a liquid crystal mother substrate, at a desired cutting position....

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B26D3/08B28D1/22B28D1/24B31B50/25C03B33/027C03B33/03C03B33/07C03B33/10
CPCB28D1/225C03B33/027C03B33/107C03B33/07C03B33/03Y10T225/325Y10T83/0385Y10T225/321Y10T83/9372Y10T225/10Y10T225/12Y10T83/0341Y10T83/0237Y10T225/371B28D5/00
Inventor TAKAMATSU, KIYOSHIMAEKAWA, KAZUYAOGASAWARA, NORIYUKI
Owner MITSUBOSHI DIAMOND IND CO LTD
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