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Heat dissipation apparatus

Inactive Publication Date: 2010-06-17
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0004]With developments in computing technology, electronic devices such as central processing units (CPUs) generate excessive heat during normal operation, which can deteriorate operational stability and damage associated elements. The heat must be removed quickly. A commonly used heat dissipation apparatus includes a heat sink mounted on a CPU. The typical heat sink includes a plurality of parallel fins and several heat pipes passing therethrough. However, such apparatus is heavy and dissipating efficiency low.

Problems solved by technology

With developments in computing technology, electronic devices such as central processing units (CPUs) generate excessive heat during normal operation, which can deteriorate operational stability and damage associated elements.
However, such apparatus is heavy and dissipating efficiency low.

Method used

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Embodiment Construction

[0008]FIG. 1 is an exploded view of an embodiment of a heat dissipation apparatus. The heat dissipation apparatus includes a heat sink 10, and a fan 20 configured to be fixed on the heat sink 10.

[0009]The heat sink 10 includes a base 11, and a plurality of radial fins 12 formed on a top surface of the base 11. A bottom surface of the base 11 is configured to contact a heat source, such as a central processing unit (CPU). The heat generated by the heat source is transmitted to the fins 12 via the base 11. The fins 12 angle upwardly from the top surface of the base 11 to form a truncated conical space in the middle of the heat sink 10. A cross section of the truncated conical space gradually increases from the top surface of the base 11 to a top end of the fins 12. A top of the truncated conical space forms an air inlet for the fan 20. A plurality of guiding members 13 is formed behind the outmost fins 12 to define a plurality of air outlets 14 between adjacent fins 12. The airflow fr...

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PUM

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Abstract

A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a heat dissipation apparatus.[0003]2. Description of Related Art[0004]With developments in computing technology, electronic devices such as central processing units (CPUs) generate excessive heat during normal operation, which can deteriorate operational stability and damage associated elements. The heat must be removed quickly. A commonly used heat dissipation apparatus includes a heat sink mounted on a CPU. The typical heat sink includes a plurality of parallel fins and several heat pipes passing therethrough. However, such apparatus is heavy and dissipating efficiency low.BRIEF DESCRIPTION OF THE DRAWINGS[0005]Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like referenc...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/467H01L2924/0002H01L2924/00
Inventor CAO, LIANG-LIANGDU, ZHONG-YONGLI, YANGGUO, LEI
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD