Electronic Apparatus Cooling Device With Integrated Pump And Heat Receiving Part

Abstract

An electronic apparatus cooling device which cools an exothermic body by heat transfer of refrigerant, includes a heat receiving part having a base for receiving heat generated by the exothermic body, a pressure member with an opening, covering part of the base and being located opposite to the exothermic body, and a flow channel allowing the refrigerant to flow therein, a heat radiator for radiating heat absorbed by the refrigerant, and a pump for circulating the refrigerant between the heat receiving part and the heat radiator. In the flow channel of the heat receiving part, the refrigerant flows in through the opening of the pressure member and flows out from the periphery of the pressure member in places other than the opening.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application is a continuation of U.S. application Ser. No. 12 / 421,749, filed Apr. 10, 2009, the contents of which are incorporated herein by reference.CLAIM OF PRIORITY[0002]The present application claims priority from Japanese patent application serial no. JP 2008-149469, filed on Jun. 6, 2008, the content of which is hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0003]1. Field of the Invention[0004]The present invention relates to cooling devices for electronic apparatuses incorporating semiconductor integrated circuits and more particularly to a cooling device which efficiently cools the semiconductor integrated circuit of an electronic apparatus.[0005]2. Description of the Related Art[0006]Recent electronic apparatuses incorporate high performance semiconductor integrated circuits as typified by CPUs used in personal computers. Mainly because of the demand for higher performance in electronic ap...

AI Technical Summary

Benefits of technology

The solution prevents deterioration in heat receiving performance, reduces heat transfer to the pump, and enables the creation of a compact, high-performance cooling device that improves electronic apparatus performance, such as in small personal computers, with a pump temperature 3 to 6 degrees lower than without the pressure member.

Problems solved by technology

However, from the viewpoint of the ability to receive heat, this heat receiving structure may be lower in heat receiving performance than a heat receiving structure dedicated to heat reception, such as an elaborate finned structure.

Besides, another problem is that heat is easily transferred from the exothermic body to the pump and the service life of the pump is unfavorably affected.

In this case, since the flow channel resistance between fins is high, if fitting or contact with the casing is inadequate, refrigerant may flow not between fins but flow in gaps in the fitting or contact area, resulting in a considerable deterioration in the heat receiving performance.

Also, when the fins are smaller, the distance between the exothermic body and the fin top is shorter, so there is a problem that the heat of the exothermic body is easily transferred to the pump through the fins.

However, the technique does not suggest any concrete means to solve these problems.

Images