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Cooling system for electronic device

a technology of electronic devices and cooling systems, applied in indirect heat exchangers, electrical appliances, light and heating equipment, etc., can solve the problems of high cost, large heat generation of server systems, and use of air conditioners

Inactive Publication Date: 2013-01-31
HON HAI PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present patent relates to a cooling system for electronic devices, which is designed to reduce the amount of heat generated by the device during operation. The cooling system includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first heat exchanger is located within the electronic device for cooling it, while the second heat exchanger is used for cooling the refrigerants that circulate through it. The refrigerants are transferred between the first and second heat exchangers using the first and second refrigerant pipes. The pump is used to circulate the refrigerants. The cooling system can use liquefied gas, such as liquefied natural gas or liquid nitrogen, as the heat medium for cooling. The technical effect of this cooling system is to provide an energy-efficient solution for cooling electronic devices by reducing the amount of heat generated by the device during operation.

Problems solved by technology

During operation, server systems generate a lot of heat in the data centers, and a common method for dissipating the heat is to use air conditioners, which are very expensive.

Method used

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Embodiment Construction

[0007]The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0008]Referring to the FIGURE, an embodiment of a cooling system is provided for cooling an electronic device 10. The cooling system includes a first heat exchanger 20, a second heat exchanger 50, a first refrigerant pipe 30, a second refrigerant pipe 40, and a pump 31. The first and second refrigerant pipes 30 and 40 receive refrigerants, which can circulate in the first and second heat exchangers 20 and 50.

[0009]The electronic device 10 may be a container data center, which can generate a lot of heat.

[0010]The first heat exchanger 20 is arranged in the electronic device 10 for cooling the electronic device 10.

[0011]The second heat exchanger 50 is used for cooling the refrigerants flowing through the...

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PUM

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Abstract

A cooling system for cooling an electronic device includes a first heat exchanger, a second heat exchanger, a first refrigerant pipe, a second refrigerant pipe, and a pump. The first and second refrigerant pipes receive refrigerants, which can circulate in the first and second heat exchangers. The first heat exchanger is arranged in the electronic device for cooling the electronic device. The second heat exchanger is used for cooling the refrigerants by gasifying liquefied gas. The pump is used for circulating the refrigerants.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to cooling systems, and particularly, to a cooling system for an electronic device.[0003]2. Description of Related Art[0004]With increasing heavy use of on-line applications, the need for computer data centers has increased rapidly. Data centers are centralized computing facilities that include many servers, often arranged on server racks or shelves, and one rack or shelf with several servers can be considered a server system. During operation, server systems generate a lot of heat in the data centers, and a common method for dissipating the heat is to use air conditioners, which are very expensive. Therefore an energy-saving cooling system is needed.BRIEF DESCRIPTION OF THE DRAWING[0005]Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustra...

Claims

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Application Information

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IPC IPC(8): F28D15/00
CPCH05K7/20745
Inventor SU, TSUNG-HANCHEN, CHUN-MING
Owner HON HAI PRECISION IND CO LTD