Fluid cooled semiconductor die package

Abstract

A fluid cooled semiconductor die package includes a package support substrate with a die mounting surface and an opposite package mounting surface. The package support substrate has external connector solder deposits on respective external connector pads of the package mounting surface, and a package fluid inlet duct and a package fluid outlet duct each providing fluid communication between the die mounting surface and package mounting surface. A semiconductor die is mounted on the die mounting surface. The die has external terminals electrically connected to the external connector pads. An inlet solder deposit is soldered to an inlet pad of the package mounting surface. The inlet pad surrounds an entrance of the fluid inlet duct. An outlet solder deposit is soldered to an outlet pad of the package mounting surface. The outlet pad surrounds an exit of the package fluid inlet duct.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to integrated circuit packaging and, more particularly, to a fluid cooled semiconductor die package.[0002]Electronic devices, such as integrated circuits or semiconductor die packages, generate heat during operation. Such packages are commonly cooled to ensure proper functioning and to enable higher operating speeds. A basic package cooling system may promote convective cooling using a fan that directs forced air to flow over the package's outer surface. In addition, a heat sink (e.g., a metal body having a substantially flat contact surface and a plurality of projections or fins) may be placed in thermal contact with the package. During operation, heat is conducted away from the package and into the projections, which are convectively cooled.[0003]Although fairly reliable and inexpensive to implement, convection cooling systems of the type described above are not always adequate especially for packages that consume rela...

AI Technical Summary

Problems solved by technology

Although fairly reliable and inexpensive to implement, convection cooling systems of the type described above are not always adequate especially for packages that consume relatively large currents.

These refrigeration systems and piped fluid coolant systems often continually supply a refrigerant or liquid coolant flow through the package by use of conduits, with the connections between the conduits being hermetically sealed by small relatively expensive hermetically sealable couplings.

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