Shadow frame support
a technology of shadow frame and support, which is applied in the direction of coating, electric discharge tube, metal material coating process, etc., can solve the problems of contaminating the surface of the substrate, affecting the cleaning effect, and affecting the appearance of the substra
Inactive Publication Date: 2017-10-26
APPLIED MATERIALS INC
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Benefits of technology
The present invention provides a processing chamber with shadow frame supports that direct cleaning gas flow to the corners of the chamber. The shadow frame supports are positioned along the chamber walls, leaving the corners unoccupied. During cleaning, the shadow frame rests on both the substrate support and the shadow frame supports. This results in a blockage of the cleaning gas flow along the chamber walls, leading to a forced flow to the corners where the shadow frame supports do not extend. The invention also provides a processing apparatus comprising a chamber body and a plurality of shadow frame supports attached to the chamber walls at specific locations. The cleaning method involves disposing the shadow frame on top of the shadow frame supports within the chamber and raising the substrate support to a position above the shadow frame. The technical effects of the invention include improved cleaning efficiency, reduced gas flow blockage, and improved substrate processing consistency.
Problems solved by technology
These deposits may become friable and contaminate the surface of the substrate.
Method used
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[0020]The present invention generally provides a processing chamber having shadow frame supports that direct cleaning gas flow to the corners of the chamber. The shadow frame supports are disposed along part of the chamber walls, thus leaving the corners unoccupied. During cleaning, the shadow frame is disposed in a way that it rests on both the substrate support and the shadow frame supports. Therefore, the cleaning gas flowing along the chamber walls is blocked by the shadow frame supports and the cleaning gas is forced to the corners since the shadow frame supports do not extend to the corners.
[0021]The invention is illustratively described below utilized in a processing system, such as a plasma enhanced chemical vapor deposition (PECVD) system available from AKT America, a division of Applied Materials, Inc., Santa Clara, Calif. However, it should be understood that the invention has utility in other system configurations, including those sold by other manufacturers.
[0022]FIG. 1...
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Abstract
The present invention generally provides a processing chamber having shadow frame supports that direct cleaning gas flow to the corners of the chamber. The shadow frame supports are disposed along part of the chamber walls, thus leaving the corners unoccupied. During cleaning, the shadow frame is disposed in a way that it rests on both the substrate support and the shadow frame supports. Therefore, the cleaning gas flowing along the chamber walls is blocked by the shadow frame supports and the cleaning gas is forced to the corners since the shadow frame supports do not extend to the corners.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation application of co-pending U.S. patent application Ser. No. 14 / 037,719, filed on Sep. 26, 2013, which claims benefit of U.S. Provisional Patent Application Ser. No. 61 / 715,719, filed on Oct. 18, 2012. Each of afore mentioned patent applications are incorporated herein by reference.BACKGROUND OF THE INVENTIONField of the Invention[0002]Embodiments of the present invention generally relate to a processing chamber and cleaning methods.Description of the Related Art[0003]Substrate processing chambers provide a wide variety of functions. Often, when depositing dielectric layers on the substrate, the residue from the deposition process collects on the walls and other surfaces of the processing chambers. These deposits may become friable and contaminate the surface of the substrate. Because the chambers are usually part of an integrated tool to rapidly process substrates, it is essential that maintenance and cle...
Claims
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IPC IPC(8): C23C16/44H01J37/32
CPCC23C16/4405H01J37/32449H01J37/32862
InventorOHASHI, KENGOHASHIMOTO, TAKAOABE, SHINOBU
OwnerAPPLIED MATERIALS INC