Envelope-tracking power supply modulator

a power supply modulator and envelope tracking technology, applied in the direction of amplifiers, amplifier types, electrical equipment, etc., can solve the problems of increasing the overall cost and area of the circuit, and the difference between is considered, so as to reduce hardware costs and avoid energy waste

Active Publication Date: 2018-12-20
REALTEK SEMICON CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The ETSM of this disclosure requires only one inductor to achieve power supply control of linear amplifiers and radio frequency power amplifiers (RFPAs), thereby reducing hardware costs. In addition, compared to the prior ar

Problems solved by technology

Consequently, a power management circuit that originally supplies a constant voltage must be adapted to accordingly adjust its output voltage in a dynamic manner to avoid unnecessary power consumption, which results from a considerable difference between an output voltage of a radio frequency pow

Method used

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Embodiment Construction

[0016]The following description is written by referring to terms of this technical field. If any term is defined in this specification, such term should be explained accordingly. In addition, the connection between objects or events in the below-described embodiments can be direct or indirect provided that these embodiments are practicable under such connection. Said “indirect” means that an intermediate object or a physical space exists between the objects, or an intermediate event or a time interval exists between the events.

[0017]FIG. 2 is a circuit diagram of an envelope-tracking power supply modulator (ETSM) according to an embodiment of this disclosure. The ETSM 200 includes a single inductor multiple output (SIMO) switch-mode converter 210, a controller 220, a capacitor CREG, and a linear amplifier LA. The term “SIMO” means two or more than two outputs are included, and a single inductor dual output (SIDO) switch-mode converter can be seen an embodiment of a SIMO switch-mode ...

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Abstract

An envelope-tracking power supply modulator (ETSM) supplies power to a radio frequency power amplifier (RFPA) of a radio frequency (RF) circuit according to a baseband envelope signal. The ETSM includes a linear amplifier, a capacitor, a single inductor multiple output (SIMO) switch-mode converter, and a controller. The linear amplifier receives the baseband envelope signal, and has its output terminal coupled to a power input of the RFPA. One terminal of the capacitor is coupled to a reference voltage, and the other terminal is coupled to a power input of the linear amplifier. The SIMO switch-mode converter includes two output terminals. One of the output terminals is coupled to the capacitor and the power input of the linear amplifier, and the other of the output terminals is coupled to the output terminal of the linear amplifier and the power input of the RFPA. The controller controls the SUMO switch-mode converter.

Description

BACKGROUND1. Field of the Disclosure[0001]The present disclosure generally relates to dynamic power supply technology, and, more particularly, to envelope-tracking power supply modulators.2. Description of Related Art[0002]In order to use the wireless communication band in an efficient way, modern modulation technology tends to modulate the amplitude of the envelope, resulting in a sharp increase in the peak-to-average ratio (PAPR) of the envelope. Consequently, a power management circuit that originally supplies a constant voltage must be adapted to accordingly adjust its output voltage in a dynamic manner to avoid unnecessary power consumption, which results from a considerable difference between an output voltage of a radio frequency power amplifier (RFPA) employed in a transmitting end of a wireless communication system and an output voltage of the power management circuit. This type of power management circuit is referred to as a composite envelope-tracking power supply modulat...

Claims

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Application Information

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IPC IPC(8): H03F1/02H03F3/19H03F3/21
CPCH03F1/0227H03F3/19H03F3/21H03F2200/102H03F2200/451H03F2200/507
Inventor CHEN, KE-HORNGYANG, SHANG-HSIENTSAI, TSUNG-YEN
Owner REALTEK SEMICON CORP
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