Cantilever having step-up structure and method for manufacturing the same
a technology of micro electro mechanical system and manufacturing method, which is applied in the direction of generator/motor, fluid speed measurement, instruments, etc., can solve the problems of inability to use cantilever for performance degradation of cantilever, etc., and achieves the reduction of the deformation of the cantilever due to the manufacturing process of the cantilever, the effect of improving the yield of the cantilever and improving the reliability of micro and high-precision products using the cantil
Inactive Publication Date: 2004-11-09
SAMSUNG ELECTRONICS CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
According to the cantilever and manufacturing method for the same of the present invention, deformations of the cantilever due to the manufacturing process thereof are minimized. Consequently, the yield of the cantilever is improved, and the reliability of micro and high-precision products which use the cantilever is also improved.
Problems solved by technology
According to a slope of the remaining bending stress, deformations of the cantilever appear, performances of the cantilever deteriorate, and the cantilever cannot be used for micro and high-precision products.
Method used
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Embodiment Construction
To verify the results of the modeling analysis, the first through fourth cantilevers are manufactured, and the bending deformations at ends of the cantilevers are measured. A method of manufacturing the cantilevers will now be described with reference to FIGS. 8 through 17.
As shown in FIG. 8, to manufacture the second cantilever, a field oxide layer 72 is formed on a predetermined region of a substrate 70 to define an active region 74. After forming a gate electrode G on the active region, a source S and a drain D are formed at corresponding sides of the gate electrode G to form a transistor. A sacrificial layer 78 such as a phosphosilicate glass (PSG) layer is formed on the substrate 70 having the transistor. The sacrificial layer 78 will be removed to form an air gap between the substrate 70 and a MEMS driving device. An etch stop layer 80 and a photosensitive layer 82 are then successively formed on the sacrificial layer 78. The photosensitive layer 82 is patterned by using a mas...
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Abstract
A cantilever having a step-up structure and a method of manufacturing the same. The cantilever includes a substrate, an anchor formed on the substrate, and a moving plate connected to the anchor while maintaining a predetermined gap from the substrate. The anchor includes a first anchor of a predetermined shape and a second anchor perpendicular to an edge of the first anchor while being formed along a longitudinal axis of the moving plate. Accordingly, a deformation of the cantilever caused by the high temperature and pressure in a manufacturing process thereof is considerably reduced. As a result, the yield rate of the cantilever is improved, and the reliability of a product using the cantilever is also improved.
Description
This application claims the benefit of Korean Patent Application No. 2002-434 filed on Jan. 4, 2002, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.1. Field of the InventionThe present invention relates to a micro electro mechanical system (MEMS) driving device, and more particularly, to a cantilever having a step-up structure which reduces a deformation of a moving plate and a method of manufacturing the same.2. Description of the Related ArtGenerally, a MEMS driving device, such as a MEMS switch, is an application device used to route a signal and match impedance networks in a radio communication system which uses microwaves or millimeter waves.Typical MEMS techniques used to produce a MEMS are a bulk micro-machining technique and a surface micro-machining technique. The bulk micro-machine technique enables a mechanical driving by forming an air gap through melting a portion of a substrate after forming a multiple-layer on t...
Claims
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IPC IPC(8): B81B3/00B81B7/00B81C1/00H01L41/08H01L41/09H01L41/187H01L41/22H01L41/311
CPCB81B3/0078B81C1/0015B81B2203/0118B81B2203/0307B81C2201/014B81C2201/0109B81B2203/04B81B7/00
Inventor LEE, HEE-JOONG
Owner SAMSUNG ELECTRONICS CO LTD