Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wireless IC device and electronic apparatus

a wireless ic and electronic equipment technology, applied in the field of wireless ic devices, can solve the problems of exceedingly miniaturized feeder circuit substrates, and achieve the effect of eliminating the possibility of damage and simple and low-cost mounting of wireless ics

Active Publication Date: 2011-03-15
MURATA MFG CO LTD
View PDF313 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]In view of the above, preferred embodiments of the present invention provide a wireless IC device that can achieve miniaturization, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of any damage occurring to the wireless IC due to static electricity, and provide an electronic apparatus equipped including such a novel wireless IC device.
[0010]In addition, preferred embodiments of the present invention provide a wireless IC device that achieves the advantages of the preferred embodiments described in the preceding paragraph and is able to withstand against an impact due to a drop, or the like, and a stress due to heat shrinkage, and to provide an electronic apparatus including the novel IC device.

Problems solved by technology

Thus, the feeder circuit substrate may be exceedingly miniaturized.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0068]Hereinafter, preferred embodiments of a wireless IC device and an electronic apparatus according to the present invention will be described with reference to the accompanying drawings. Note that in the drawings, like reference numerals denote like components or portions, and the overlap description is omitted.

First Preferred Embodiment of Wireless IC Device, See FIG. 1

[0069]FIG. 1 shows a wireless IC device according to a first preferred embodiment of the present invention. The wireless IC device 1 includes a wireless IC chip 5, a feeder circuit substrate 10, and radiation plates 21a and 21b. The wireless IC chip 5 processes transmission and reception signals of a predetermined frequency. The wireless IC chip 5 is mounted on the feeder circuit substrate 10. The radiation plates 21a and 21b are provided for a radiation substrate (printed wiring board) 20.

[0070]The wireless IC chip 5 preferably includes a clock circuit, a logic circuit, a memory circuit, and the like. The wirele...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a wireless IC device and, more particularly, to a wireless IC device that has a wireless IC used in an RFID (Radio Frequency Identification) system, and an electronic apparatus.[0003]2. Description of the Related Art[0004]In recent years, an RFID system has been developed as an article management system, which includes a reader / writer that generates an induction field and an IC chip (also referred to as IC tag or wireless IC chip) that stores predetermined information allocated to an article or a casing, and non-contact communication is established between the reader / writer and the IC chip to transmit the information therebetween.[0005]A known existing wireless IC device equipped with an IC chip includes a wireless IC tag as described in Japanese Unexamined Patent Application Publication No. 2005-244778. In the wireless IC tag, a dipole antenna (formed of a pair of main antenna elements ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): G06K19/06
Inventor IKEMOTO, NOBUOISHINO, SATOSHIDOKAI, YUYAKATO, NOBORUKATAYA, TAKESHIKIMURA, IKUHEITANAKA, MIKIKO
Owner MURATA MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com