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Wiring board assembly and manufacturing method thereof

a technology of wiring board and manufacturing method, which is applied in the incorporation of printed electrical components, electrical apparatus, printed circuits, etc., can solve the problems of etc., to prevent such wiring board warpage or bending, deterioration of yield rate and reliability of semiconductor package, and prevent warpage or bending of resin wiring board.

Inactive Publication Date: 2012-11-13
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]It is therefore an object of the present invention to provide a wiring board assembly having a wiring board and a reinforcing member fixed to the wiring board so as to relieve a stress on the reinforcing member and prevent warpage or bending of the wiring board assuredly. It is also an object of the present invention to provide a method of manufacturing the wiring board assembly.

Problems solved by technology

There thus arises a possibility of concentration of the thermal stress on such connected corner portions of the stiffener 110 whereby the stiffener110 may fail to prevent warpage or bending of the resin wiring board.
The occurrence of warpage or bending of the resin wiring board causes a deterioration in yield rate and reliability of the semiconductor package due to the difficulty of properly mounting the IC chip on the wiring board.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[First Embodiment]

[0040]As shown in FIGS. 1 and 2, a semiconductor package 10 according to the first embodiment of the present invention includes a wiring board 40, a chip 21 mounted on the wiring board 40 and a stiffener 31 fixed as a reinforcing member to the wiring board 40. In the first embodiment, the semiconductor package 10 has a ball grid array (BGA) configuration. The configuration of the semiconductor package 10 is not however limited to the BGA package configuration. The semiconductor package 10 may alternatively have a pin grid array (PGA) configuration, a land grid array (LGA) configuration or any other configuration. Further, the form of the chip 21 is not particularly limited. The chip 21 can be either a chip condenser, a semiconductor integrated circuit chip (IC chip) such as DRAM (Dynamic Random Access Memory) or SRAM (Static Random Access Memory) for use as a microprocessor in a computer, a MEMS (Micro Electro Mechanical System) element produced by a semiconductor ...

second embodiment

[Second Embodiment]

[0063]A semiconductor package 10A according to the second embodiment of the present invention includes a wiring board 40A, a chip 21 mounted on the wiring board 40A and a stiffener 31A fixed as a reinforcing member to the wiring board 40A as shown in FIGS. 15 and 16. The assembly of the wiring board 40A and the stiffener 31A and, occasionally, the chip 21 is referred to as a wiring board assembly 11A. The wiring board assembly 11A of the second embodiment is structurally similar to the wiring board assembly 11 of the first embodiment, except that: the stiffener 31A has four structural pieces 36A separated by linear slits 39A; and the wiring board 40 has a plurality of plain conduction layers 51A each arranged between adjacent ones of the resin insulation layers 43 to 46 at positions corresponding to each of the slits 39A.

[0064]As shown in FIG. 15, the slits 39A are formed in the centers of the four sides of the rectangular stiffener 31A so as to extend linearly fr...

eighth embodiments

[Third to Eighth Embodiments]

[0068]The shape and number of the structural pieces 36, 36A (i.e. the form, position and number of the slits 39, 39A) of the stiffener 31, 31A are not particularly limited to the above and can be modified as appropriate as in the following embodiments.

[0069]A stiffener 31B for a wiring board according to the third embodiment of the present invention (as a modification of the first embodiment) has four structural pieces 36B separated by non-linear slits 39B as shown in FIG. 17. In the third embodiment, the slits 39B are formed into a crank shape as viewed from the side in contrast to the first embodiment in which the slits 39 are a crank shape as viewed from the top.

[0070]A stiffener 31C for a wiring board according to the fourth embodiment of the present embodiment (as one modification of the second embodiment) has four structural pieces 36C separated by linear slits 39C as shown in FIG. 18. A stiffener 31D for a wiring board according to the fifth embod...

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PUM

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Abstract

A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to a wiring board assembly in which a wiring board is reinforced by a reinforcing member to prevent warpage or bending of the wiring board, and a method of manufacturing the wiring board assembly.[0002]A semiconductor integrated circuit chip (hereinafter just referred to as “IC chip”) has various applications such as a microprocessor for a computer. There is a tendency to provide an increasing number of terminals on the IC chip with a smaller terminal pitch for higher speed and performance of the IC chip. In general, a plurality of terminals are arranged closely in an array on a bottom side of the IC chip and are connected by flip-chip bonding to terminals of a motherboard. The direct mounting of the IC chip on the motherboard is however difficult due to a great difference between the terminal pitch of the IC chip and the terminal pitch of the motherboard. It has thus been common practice to produce a semiconductor packa...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K1/16
Inventor ASANO, TOSHIYAMAEDA, SHINNOSUKE
Owner NGK SPARK PLUG CO LTD
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