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Integrated circuit package system employing a support structure with a recess

a support structure and integrated circuit technology, applied in the direction of electrical apparatus construction details, printed circuit non-printed electric components association, semiconductor/solid-state device details, etc., can solve the problem of mold bleed at the periphery of the die paddle, mold bleed remains one of the top defects seen on production lines, and the movement of the die paddle is unwanted. to achieve the effect of preventing mold bleed

Active Publication Date: 2013-04-16
STATS CHIPPAC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]The present invention provides an integrated circuit package system including: providing an electrical interconnect system including a support structure and a lead-finger system; processing a top edge of the support structure along an outermost periphery thereof, to include a recess for preventing mold bleed, the recess surrounded by the lead finger system; and encapsulating the recess and the electrical interconnect system with an encapsulation material to interlock the encapsulation material.

Problems solved by technology

Unfortunately, during encapsulation of the die paddle, the terminal leads, and the semiconductor device, the die paddle tends to lift causing a mold bleed problem at the periphery of the die paddle.
It is believed that forces produced during mold flow of the encapsulation material cause the unwanted movement of the die paddle.
Despite recognition of the mold bleed problem and one of its potential causes, mold bleed still remains one of the top defects seen on production lines.
Furthermore, attempts at mold flash removal by various chemical processes have yet to prove very effective.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Method used

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  • Integrated circuit package system employing a support structure with a recess
  • Integrated circuit package system employing a support structure with a recess
  • Integrated circuit package system employing a support structure with a recess

Examples

Experimental program
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embodiment one

[0025]Referring now to FIG. 1, therein is shown a top view of an integrated circuit package system 100, in accordance with an embodiment of the present invention. For purposes of illustration and ease of discussion, an encapsulating material (described in FIG. 3) has been removed.

[0026]The integrated circuit package system 100 includes a device 102, a support structure 104, a corner tie bar 105, an electrical interconnect system 106, a lead-finger system 108, a device bonding pad 110, a wire bond 112, and a recess 114. By way of example, the device 102 may include semiconductor chips and integrated circuit packages selected from active components, passive components, stacked components, memory components, and so forth, in numerous configurations and arrangements as may be needed. It is to be understood that the device 102 covers a wide range of semiconductor chip and integrated circuit package configurations involving various sizes, dimensions, and electrical contact techniques, and...

embodiment two

[0046]FIG. 4 depicts a top view of an integrated circuit package system 400 in accordance with another embodiment of the present invention. For purposes of illustration and ease of discussion, the encapsulating material has been removed. The integrated circuit package system 400 includes the device 102, the support structure 104, the corner tie bar 105, the electrical interconnect system 106, the lead-finger system 108, the device bonding pad 110, the wire bond 112, the recess 114, and a ground structure 402.

[0047]Per this embodiment, the top edge or periphery of the support structure 104 is processed to include the ground structure 402 formed within the recess 114. The ground structure 402 may include a projection that separates or interrupts the recess 114 along the top edge or periphery of the support structure 104. The ground structure 402 may provide a grounding point for the wire bond 112 from the device 102 (i.e.—a down bond) or for the wire bond 112 from the lead-finger syst...

embodiment three

[0053]Referring now to FIG. 7, therein is shown a top view of an integrated circuit package system 700, in accordance with another embodiment of the present invention. For purposes of illustration and ease of discussion, the encapsulating material has been removed.

[0054]The integrated circuit package system 700 includes the device 102, the support structure 104, the corner tie bar 105, the electrical interconnect system 106, the lead-finger system 108, the device bonding pad 110, the wire bond 112, the recess 114, and a first low resistivity interface 702. By way of example, the device 102 may include semiconductor chips and integrated circuit packages selected from active components, passive components, stacked components, memory components, and so forth, in numerous configurations and arrangements as may be needed. It is to be understood that the device 102 covers a wide range of semiconductor chip and integrated circuit package configurations involving various sizes, dimensions, ...

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Abstract

An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; processing a top edge of the support structure along an outermost periphery thereof, to include a recess for preventing mold bleed, the recess surrounded by the lead finger system; and encapsulating the recess and the electrical interconnect system with an encapsulation material to interlock the encapsulation material.

Description

TECHNICAL FIELD[0001]The present invention relates generally to integrated circuits, and more particularly to an integrated circuit package system employing a support structure with a recess.BACKGROUND ART[0002]Integrated circuits can be found in many of today's consumer electronics. For example, integrated circuits can be found in cellphones, video cameras, portable music players, computers, and even automobiles. The general principles of packaging an integrated circuit are well known. Ordinarily, a leadframe is employed which may include a die paddle and terminal leads arranged in a pre-selected arrangement around the periphery of the die paddle. A semiconductor device is attached to the die paddle and wire bonding or the like is used to interconnect bonding pads on the semiconductor device to the terminal leads. These assemblies are then encapsulated in a molding compound. This general process may be used to produce various integrated circuit package configurations.[0003]Unfortun...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K7/00
CPCH01L23/49503H01L23/49548H01L24/83H01L21/565H01L23/50H01L24/85H01L2224/49171H01L2224/83136H01L2924/01046H01L2924/14H01L2924/18301H01L2924/3025H01L2224/85H01L24/48H01L24/49H01L2224/32245H01L2224/48247H01L2224/48253H01L2224/48257H01L2224/73265H01L2924/19107H01L2924/01029H01L2924/00012H01L2924/181H01L24/73H01L2224/05554H01L2924/00014H01L2224/49109H01L2224/45099H01L2224/45015H01L2924/207
Inventor CHOW, SENG GUANDIMAANO, JR., ANTONIO B.
Owner STATS CHIPPAC LTD