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Planar heater structures for ejection devices

a technology of ejection device and heater, which is applied in the direction of printing, etc., can solve the problems of slow process for msq polishing by cmp technique, problem in patterning aluminum by cmp technique, and inability to completely/efficiently use existing cmos backend processes

Active Publication Date: 2014-09-16
LEXMARK INT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing CMOS backend processes are incapable of completely / efficiently using the advantage of frontend CMP technique.
Though, polishing of MSQ by the CMP technique is a slow process, and sometimes prone to defects, however, there exist appropriate slurries and compatible CMP methods that may effectively be used.
However, patterning aluminum by the CMP technique is problematic, as aluminum is a soft metal and is prone to smearing, dishing and other such defects.

Method used

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  • Planar heater structures for ejection devices
  • Planar heater structures for ejection devices
  • Planar heater structures for ejection devices

Examples

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Embodiment Construction

[0034]It is to be understood that various omissions and substitutions of equivalents are contemplated as circumstances may suggest or render expedient, but these are intended to cover the application or implementation without departing from the spirit or scope of the claims of the present disclosure. It is to be understood that the present disclosure is not limited in its application to the details of components set forth in the following description.

[0035]The present disclosure is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,”“comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Further, the terms “a” and “an” herein do not denote a limitation of quantity, but ...

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Abstract

Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

Description

CROSS REFERENCES TO RELATED APPLICATIONS[0001]None.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT[0002]None.REFERENCE TO SEQUENTIAL LISTING, ETC[0003]None.BACKGROUND[0004]1. Field of the Disclosure[0005]The present disclosure relates generally to ejection devices for printers, and more particularly, to methods for fabricating planar heater structures of the ejection devices.[0006]2. Description of the Related Art[0007]Fabrication of a typical ejection device (printhead) for a printer, such as an inkjet printer, involves fabrication of a heater structure (heater stack) using a substrate wafer, such as a silicon-based substrate wafer. Specifically, the substrate wafer may be used for arranging one or more fluid ejection elements (resistor elements / heat resistors) thereupon and for configuring a flow feature layer and a nozzle plate over the substrate wafer. Further, a drive circuitry layer made by complementary metal-oxide-semiconductor (CMOS) implantation may be used...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): B41J2/05B41J2/14B41J2/16
CPCB41J2/14112B41J2/1646B41J2/1628B41J2/1601
Inventor GUAN, YIMINJOYNER, II, BURTONREITMEIER, ZACH
Owner LEXMARK INT INC