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Radiating mould set

A heat dissipation module and heat dissipation chamber technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve problems such as reduced heat transfer rate, uneven heat dissipation, and limited heat transfer efficiency. Achieve the effect of increasing heat and improving heat dissipation efficiency

Inactive Publication Date: 2007-09-26
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the difference between the surface temperature of the heat source (heating electronic components) (for example, the surface of a central processing unit is about 65-70°C) and the cooling air temperature is only about 25°C, which greatly limits the heat transfer efficiency
Furthermore, limited by the design of the fan motor, the air volume at the center of the cooling fin 102 under the motor stator is the smallest, but this is where the heat source is most concentrated and the temperature is the highest, which not only reduces the heat transfer rate but also easily leads to heat dissipation uneven problem

Method used

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  • Radiating mould set
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  • Radiating mould set

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Embodiment Construction

[0032] FIG. 2 is a schematic diagram according to an embodiment of the present invention to show the design principle of the heat dissipation module of the present invention.

[0033] As shown in FIG. 2 , the heat dissipation module according to this embodiment is mainly composed of an air compressor (air compressor) 10 and a heat dissipation component 12 designed in advance. The air compressor 10 is connected to the heat dissipation component 12 by an airtight pipeline. After the air is compressed by the compressor 10, it can enter it at a high speed through an air inlet of the heat dissipation component 12 as shown by the arrow, and then be discharged from an exhaust port. And a pressure controller 30 can be arranged on the airtight pipeline to adjust the air pressure and air flow.

[0034] According to this embodiment, the heat dissipation member 12 is formed by a plate-shaped member 14 and heat sinks 16 (heat sinks) closely combined. The heat sink 16 is made of a material...

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Abstract

The invention consists of an air transportation device, a heat emission chamber that at least has an air intake port and an exhaust port. A heat conduction enhancement structure is formed on inner wall of heat emission chamber, and a heating element is stuck on out wall of it. The air transportation device is connected with pipe by which air flow pass in and out the heat emission chamber. The heat conduction enhancement structure includes a channel for air flow traveling in heat emission chamber.

Description

【Technical field】 [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module which can effectively improve heat dissipation efficiency. 【Background technique】 [0002] With the improvement of the performance of the electronic device, the cooling capacity of the heat dissipation structure of the electronic device needs to be increased at the same time, so as to effectively dissipate a large amount of heat energy generated by the heating element. [0003] FIG. 1 is a schematic diagram showing a heat sink 100 mounted on a heat-generating electronic component (not shown). The cooling device 100 includes a heat sink 102 and an axial flow fan 104. When the heat sink 102 absorbs the heat energy generated by the heating element through heat conduction, the airflow generated by the operation of the axial flow fan 104 can absorb the heat energy absorbed by the heat sink 102. Scattered. [0004] However, in the conventional collocation mode ...

Claims

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Application Information

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IPC IPC(8): H01L23/467H05K7/20G06F1/20F28D15/00
Inventor 李奕升谭理光
Owner DELTA ELECTRONICS INC