Packaging protecting structure

Abstract

The invention discloses a packaging protection arrangement which covers a circuit element on the substrate completely, wherein the packaging protection structure includes a first layer type diamond carbon diaphragm for use as the bottom layer of the packaging protection arrangement, a breaker arranged on the surface of the first layer type diamond carbon diaphragm, and a second layer type diamond carbon diaphragm covering the breaker and part of the first layer type diamond carbon diaphragm.

Description

technical field [0001] The invention relates to a package protection structure, in particular to a package protection structure including a diamond-like carbon film circuit structure. Background technique [0002] With the rapid development of technology, thin, light, power-saving, and portable smart information products have filled our living space, and monitors have played a very important role in it, whether it is mobile phones, personal digital assistants or notebook computers. A display is required as an interface for man-machine communication. Under the demand of high image quality, large screen and low cost, an organic light-emitting display (OLED) made of organic materials has a simple structure and excellent working temperature, contrast, viewing angle and It has the advantages of light-emitting diode (LED) rectification and light-emitting characteristics, and gradually attracts attention in the display market. [0003] Since organic light-emitting displays use li...

AI Technical Summary

Problems solved by technology

Generally speaking, some display devices that are sensitive to water vapor, such as organic light-emitting displays, usually require a water permeability of 0.05g / m 2 day (0.05g of water seepage per square meter per day), so the existing packaging protection structure must contain at least a multi-layer stacked structure of more than five layers to achieve the effect of effectively preventing water vapor from entering, but because the heat dissipation effect of the components is not taken into account Therefore, although this multi-layer stack structure can provide a better water vapor protection effect, it often has poor heat dissipation effect, and the process is quite complicated, which requires higher manufacturing costs and more process time.

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