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Packaging protecting structure

A protective structure and carbon film technology, applied in lighting devices, electrical components, circuits, etc., can solve the problems of high cost, complicated process, high manufacturing cost, etc., to increase the life of circuit components, low moisture penetration rate, and good heat conduction sexual effect

Inactive Publication Date: 2008-03-05
TPO DISPLAY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, some display devices that are sensitive to water vapor, such as organic light-emitting displays, usually require a water permeability of 0.05g / m 2 day (0.05g of water seepage per square meter per day), so the existing packaging protection structure must contain at least a multi-layer stacked structure of more than five layers to achieve the effect of effectively preventing water vapor from entering, but because the heat dissipation effect of the components is not taken into account Therefore, although this multi-layer stack structure can provide a better water vapor protection effect, it often has poor heat dissipation effect, and the process is quite complicated, which requires higher manufacturing costs and more process time.

Method used

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Embodiment Construction

[0027] The present invention discloses a package protection structure. In order to fully demonstrate the advantages of the present invention, an organic light-emitting display is taken as an example to illustrate the package protection structure of the present invention. However, the scope of application of the present invention is not limited thereto. It can be applied to various circuit elements, such as liquid crystal displays, semiconductor devices, and the like.

[0028] Please refer to FIG. 2 , which is a schematic cross-sectional view of a package protection structure of an organic light emitting display in a preferred embodiment of the present invention. As shown in FIG. 2 , the organic light emitting display 110 includes a base 112 and a display unit 114 disposed on the surface of the base 112 to define a display area 126 and a peripheral area 128 . In addition, the organic light emitting display 110 further includes an encapsulation protection layer 118 disposed on t...

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Abstract

The invention discloses a packaging protection arrangement which covers a circuit element on the substrate completely, wherein the packaging protection structure includes a first layer type diamond carbon diaphragm for use as the bottom layer of the packaging protection arrangement, a breaker arranged on the surface of the first layer type diamond carbon diaphragm, and a second layer type diamond carbon diaphragm covering the breaker and part of the first layer type diamond carbon diaphragm.

Description

technical field [0001] The invention relates to a package protection structure, in particular to a package protection structure including a diamond-like carbon film circuit structure. Background technique [0002] With the rapid development of technology, thin, light, power-saving, and portable smart information products have filled our living space, and monitors have played a very important role in it, whether it is mobile phones, personal digital assistants or notebook computers. A display is required as an interface for man-machine communication. Under the demand of high image quality, large screen and low cost, an organic light-emitting display (OLED) made of organic materials has a simple structure and excellent working temperature, contrast, viewing angle and It has the advantages of light-emitting diode (LED) rectification and light-emitting characteristics, and gradually attracts attention in the display market. [0003] Since organic light-emitting displays use li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H05B33/04H05B33/10
Inventor 陈光荣
Owner TPO DISPLAY
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