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Package structure for optical device

An optical device and housing technology, applied in the field of optical device housing structure, can solve the problems of wire breakage, light-transmitting resin breakage, optical device damage, etc., and achieve the effect of preventing wire breakage and reducing thermal stress.

Inactive Publication Date: 2009-01-21
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a problem that when the optical device housing structure is used in a severe temperature environment (for example, the temperature varies in the range of -40 degrees Celsius to 105 degrees Celsius), the wires may be broken due to thermal stress in the light-transmitting resin and damage to optics
Another problem is that the light-transmitting resin can crack

Method used

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  • Package structure for optical device
  • Package structure for optical device
  • Package structure for optical device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0067] Figure 1A is a cross-sectional view showing the structure of the optical device housing of the first embodiment of the present invention. Figure 1B is a plan view showing the structure of the optical device housing of the first embodiment.

[0068] In the optical device package structure, an LED (Light Emitting Diode) 6 as an optical device is mounted on the lower surface side of the mounting portion 5 of the lead frame in FIG. 1 . The aperture 5a through which the light emitted by the LED 6 passes is located at the mounting portion 5 of the lead frame, and the light emitting portion of the LED 6 faces the aperture 5a. The LED 6 is electrically connected to the lead portion 3 of the lead frame through a wire 9 . The wire 9 is located on one side of the lead frame in the mounting section (the side where the LED 6 is mounted). The LED 6 and the leads 9 are sealed with a low stress resin 2 containing silica as a filler. The low-stress resin 2 is located on the side of...

no. 2 example

[0074] figure 2 is a sectional view showing the structure of the optical device housing of the second embodiment.

[0075] The optical device housing structure of the second embodiment is different from that of the first embodiment only in the configuration of the crack prevention structure. In the second embodiment, the same components as those of the first embodiment are denoted by the same reference numerals and will not be described in detail.

[0076] The anti-crack structure possessed by the optical device housing structure of the second embodiment is formed by the recessed portion 32 located at the lead portion 3 of the lead frame, the low-stress resin portion 22 located in the recessed portion 32, and the contact with the low-stress resin portion 22. The end portion 81 of the light-transmitting resin is jointly constituted. The recessed portion 32 of the lead portion of the lead frame has a cavity at the side opposite to the side where the LED 6 is mounted.

[0077...

no. 3 example

[0079] Fig. 3 is a sectional view showing the structure of an optical device housing of a third embodiment.

[0080] The optical device housing structure of the third embodiment is different from that of the first embodiment only in the configuration of the crack prevention structure. In the third embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and will not be described in detail.

[0081] The crack prevention structure possessed by the optical device housing structure of the third embodiment is constituted by the bent portion 33 located at the lead portion 3 of the lead frame and the end portion 81 of the light-transmitting resin having a connection with the bent portion 33. Edge-aligned end surfaces 83 . The bent portion 33 of the lead portion of the lead frame is bent toward the side where the LED 6 is mounted.

[0082]Even when used in an environment with relatively large temperature changes, the optical device ...

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PUM

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Abstract

An LED (6) is mounted to the mounting portion (5) of a lead frame with its light emitting portion facing an opening (5a). A wire (9) connecting the LED (6) with the lead portion (3) of the lead frame is disposed on the LED (6)-mounted side. Light transmitting resin (8) for transmitting an emitted light from the LED (6) is disposed on the side opposite to the LED (6)-mounted side of the lead frame. Low-stress resin (2) for sealing the LED (6) and the wire (9) is disposed on the LED (6)-mounted side of the lead frame. A crack preventing structure is formed by bends (31) provided to the lead portions (3) and bending to the LED (6)-mounted side, parts (21) of the low-stress resin positioned on the side opposite to the LED (6)-mounted side across the bends (31), and the ends (81) of the light transmitting resin in contact with the parts (21) of this low-stress resin.

Description

technical field [0001] The present invention relates to optical device housing structures used in relatively harsh temperature environments such as optical communications, lighting, and automobiles. Background technique [0002] Conventionally, there has been an optical device housing structure in which an optical device such as a CCD (Charge Coupled Device) is mounted on a device mounting portion of a lead frame, the optical device and the lead portion of the lead frame are connected by wires, and are sealed with a light-transmitting resin. Encapsulation of optics, wires and lead frame (see JP2000-173947A). The light-transmitting resin is formed approximately in the shape of a rectangular parallelepiped, the material of which has satisfactory transmission characteristics with respect to light incident on the optical device. A lens is integrally formed with the upper surface of the light-transmitting resin so that light is incident on the optical device through the lens. I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/54H01L33/56
CPCH01L2224/48091H01L2224/48247H01L2924/181H01L2924/19107H01L2924/00014H01L2924/00012
Inventor 石井赖成
Owner SHARP KK
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