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Anti-electrostatic discharging radiating module and system thereof

A heat dissipation module and electronic system technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problem of damage to IC components of IC chips, and achieve the effect of reducing adverse effects

Active Publication Date: 2009-03-11
VIA TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Since the integrated circuit component (IC device) on the active surface of the IC chip is very fragile, when the IC chip packaged into an electronic package is installed inside the electronic device, any ESD current generated by any reason may have IC components that may cause damage to IC chips

Method used

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  • Anti-electrostatic discharging radiating module and system thereof
  • Anti-electrostatic discharging radiating module and system thereof
  • Anti-electrostatic discharging radiating module and system thereof

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Embodiment Construction

[0038] figure 1 It is an exploded perspective view of an electronic assembly assembled to a circuit board according to an embodiment of the present invention, figure 2 yes figure 1 Combination diagram of electronic assembly and circuit board parts, image 3 yes figure 2 A cross-sectional view of an electronic assembly assembled to a circuit board. Please refer to Figure 1 to Figure 3 An electronic assembly 100 according to an embodiment of the present invention includes a substrate 110 , a chip 120 , a conductive fence 130 and a heat sink 140 . It should be noted that the substrate 110 , the chip 120 and the conductive fence 130 can constitute an electronic package, and the conductive fence 130 and the heat sink 140 can constitute a heat dissipation module.

[0039] The substrate 110 is a packaging substrate for packaging the chip 120 , and the chip 120 is bonded to a bonding surface 112 of the substrate 110 . In this embodiment, the chip 120 is connected to the bondi...

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Abstract

An electronic packaging unit includes one substrate, one chip, one conduction fence and one radiator; wherein said substrate having one joint face bonding with chip, conduction fence jointing to joint face and at least partially surrounding chip side edge, radiator set on substrate above and contacting chip and conduction fence to make conduction fence and radiator used as chip shielding, therefore capable of reducing detrimental effect of static discharge to chip.

Description

technical field [0001] The present invention relates to an electronic assembly, and in particular to an electronic assembly capable of reducing the possibility of damage to integrated circuit (IC) chips caused by Electro Static Discharge (ESD). Background technique [0002] With the rise of the semiconductor industry, IC chips are applied to almost all electronic apparatuses. In order to extend the electrodes of the IC chip and protect the structure of the IC chip itself, the IC chip is usually packaged into an electronic package through a packaging process, and then the electronic package is mounted on the mother board of the electronic device. . [0003] The flip chip bonding technology is a packaging technology for assembling an IC chip into a carrier. Compared with the traditional wire bonding technology, the flip-chip bonding technology can be applied to the packaging of IC chips with high pin count and high pin density, and can shorten the signal path. [0004] In a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/60H01L23/34H01L25/00
CPCH01L2224/16225H01L2224/73253
Inventor 郭益成黄鸿文徐振民郭能安
Owner VIA TECH INC
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