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Embedded type camera lens module group and production method thereof

A lens module and manufacturing method technology, applied in installation, optics, instruments, etc., can solve the problem of costing a lot of money, and achieve the effect of reducing thickness

Inactive Publication Date: 2009-04-01
CHICONY ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the lens effect of the original functional nature is to be maintained, a large amount of money must be spent to develop and research a new lens group, which also involves a series of complicated procedures and time. In addition, changing the height of the lens seat 41 is due to the production process. The work difference will affect the action of the existing image module below it and even interfere, and the thickness of the hard printed circuit board 25 itself is also a fixed parameter, so there is indeed a need for a simple and cost-effective production method that can reduce the thickness of the camera lens module. cheap way

Method used

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  • Embedded type camera lens module group and production method thereof
  • Embedded type camera lens module group and production method thereof
  • Embedded type camera lens module group and production method thereof

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Embodiment Construction

[0048] While the invention will be fully described with reference to the accompanying drawings, which contain preferred embodiments of the invention, it should be understood before proceeding that those skilled in the art may modify the invention described herein while still obtaining the benefits of the invention. Therefore, it should be understood that the following description is a broad disclosure for those skilled in the art, and its content is not intended to limit the present invention.

[0049] see Figure 1A to Figure 1E , is a schematic diagram of the first embodiment of the present invention. The camera lens module 1 of the present invention includes: a printed circuit board 20; an integrated circuit element 10 electrically connected to the printed circuit board 20; a lens mount 40 with a cavity, and the lens mount 40 is disposed opposite to the Above the surface of the integrated circuit element 10; and a filler 30 for connecting the printed circuit board 20, the ...

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Abstract

The present invention provides an embedded camera lens module and a producing method thereof, and includes the following procedures that a printed circuit board is provided, a first surface of the printed circuit board has a first electric joint, and a second surface of the printed circuit board forms an layout of a second electric joint, and the first electric joint communicates with the second electric joint; an integrated circuit component is provided, a connecting foot of the integrated circuit component is electrically connected to the first electric joint on the first surface of the printed circuit board; the edge above one side of the printed circuit board is bent towards the first surface, and through the second electric joint a semi-finished article of the image module whose side face contacts with the edge is formed; the semi-finished article of the image module is placed in a mold; a filling is arranged in the mold, gas in the mold between the integrated circuit component and the printed circuit board is discharged, and an embedded image module is defined and formed; a lens seat is embedded in the embedded image module, and the lens seat and the embedded image module are integrated into the embedded camera lens module through the filling; and the mold is disassembled.

Description

technical field [0001] The invention relates to an embedded camera lens module and its manufacturing method; more specifically, the invention relates to a more miniaturized camera lens module. Background technique [0002] The modern electronic industry continues to flourish. Various electronic products make people's life more comfortable and convenient. Many electronic products are facing the challenge of smaller sizes to meet the needs of consumers. [0003] see Figure 4 , is a schematic cross-sectional view of an existing camera lens module, the height of which is the sum of the heights of the hard printed circuit board 25 at the bottom, the lens mount 41 , the glue 26 and the lens group 50 . As the application range of camera modules is getting thinner and lighter, camera lens designers are trying their best to reduce their height so that they can be used in modern electronic products. [0004] To sum up the above, in order to reduce the thickness of the camera lens mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B7/02
Inventor 刘凉荣陈志清
Owner CHICONY ELECTRONICS