The invention relates to a light emitting diode package and a method for manufacturing a same, wherein the light emitting diode package uses a heat-dissipating substrate with a plurality of layers of reflectors, and wiring pattern layers are extended to bottom surfaces of a chip mounting area, thereby ensuring easiness of welding technology and reducing thickness of the package. The light emitting diode package includes a heat-dissipating substrate including a reflective groove having a lower bottom surface, an upper opening having a width greater than the lower bottom surface, and an inclined surface formed between the upper opening and the lower bottom surface and mounting grooves, each formed in the reflective groove and having a lower bottom surface, an upper opening having a width greater than the lower bottom surface, and an inclined surface formed between the upper opening and the lower bottom surface; an insulating layer selectively formed on the heat-dissipating substrate; wiring pattern layers formed on the insulating layer and extending to bottom surfaces of the mounting grooves to be selectively formed thereon; a light emitting diode chip mounted in each of the mounting grooves; and a molding layer formed around the light emitting diode chip.