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Heat resistant insulative membrane and insulative method

A technology of heat-resistant insulation and film covering, applied in the direction of insulators, organic insulators, plastic/resin/wax insulators, etc., can solve problems such as unrealistic installation, poor stability, poor shape followability, etc.

Inactive Publication Date: 2004-09-22
PIONEER CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, generally speaking, because films such as polyimide resins with high functionality have relatively poor shape followability, good performance cannot be achieved when concave or convex portions are included on the surface to be insulated (the surface to be insulated). installation, resulting in poor stability after installation
Furthermore, when the shape of the surface to be insulated is relatively complex, it is necessary to use multiple insulating films, thus resulting in a complicated manufacturing process.

Method used

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  • Heat resistant insulative membrane and insulative method
  • Heat resistant insulative membrane and insulative method
  • Heat resistant insulative membrane and insulative method

Examples

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Embodiment Construction

[0017] Embodiments of the present invention will be described below.

[0018] The heat-resistant insulating film of this embodiment is a heat-resistant resin film represented by polyimide resin, such as polyimide, polyamide, polybenzimidazole, polyester, polyimidazole, polyphenylene Base sulfide, polyamideimide, polyetherimide, polyetherketone, polysulfone, etc.

[0019] When a heat-resistant insulating film is provided on a structure including concave or convex portions, a shape pattern (hereinafter referred to as a concave-convex shape pattern) conforming to the shape can be formed by a three-dimensional molding method. Thereby, the heat-resistant insulating film can be easily installed on the object to be insulated. Firm installation can be realized even for insulating objects with surface shapes such as unevenness. In addition, the concavo-convex pattern formed on the heat-resistant insulating film is a concavo-convex pattern in which the ratio of the depth to the width ...

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PUM

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Abstract

The objective is to enable easy and economic insulation treatment by mounting an insulating film with functionality such as heat resistance in insulating a surface of an object to be insulated. In mounting the heat-resistant insulating film 21 on a base plate 30 with electronic components 31 to 38 loaded, a shape pattern 21a corresponding to a shape of the surface to be insulated including a concave part and a convex part is formed by a three-dimensional molding on the heat-resistant insulating film 21, and the electronic components 31 to 38 or a circuit board 30 is covered with the heat-resistant insulating film 21.

Description

technical field [0001] The present invention relates to a heat-resistant insulating film and an insulating method using the film. Background technique [0002] With the integration and high functionality of electronic parts, people are paying more and more attention to the importance of the function of the insulating layer formed on the electronic parts or on the substrate carrying the electronic parts. In fact, in the prior art, polyimide-based resins and the like having heat resistance, high mechanical strength, and dimensional stability have been used instead of thermosetting epoxy resins and the like used as insulating layers. Sexual resin. In general, an insulating layer based on such a polyimide-based resin or the like can be formed by the following procedure. That is, the precursor solution is coated on the surface to be insulated with a predetermined thickness, and then the imide conversion of dehydration and closed-loop is carried out by drying and heating, thereb...

Claims

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Application Information

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IPC IPC(8): H01B3/30H01B3/42H01B17/56H02K3/38H05K3/00H05K3/28
CPCH01L2924/0002H05K2203/0108Y10T428/31721H02K3/38H05K3/284H05K3/0014H05K2203/1311H05K2203/1105H01L2924/00
Inventor 半谷年正三桥久雄
Owner PIONEER CORP
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