Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing dry film solder resist, and film laminate used therein

A technology for solder mask dry film and lamination film, which can be used in photoengraving process coating equipment, patterned surface photoengraving process, opto-mechanical equipment, etc. It can solve complex and uneconomical problems and achieve excellent adhesion. , the effect of ensuring ease, resolving complexity

Active Publication Date: 2015-12-23
LG CHEM LTD
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the entire method has the disadvantage of being complicated and uneconomical due to the introduction or composition change involving a separate treatment method (such as a plasma treatment method, etc.)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing dry film solder resist, and film laminate used therein
  • Method for preparing dry film solder resist, and film laminate used therein
  • Method for preparing dry film solder resist, and film laminate used therein

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0115] (1) Preparation of photocurable and thermally curable resin compositions

[0116] By adding 41.5% by weight of ZFR-1122 (NipponKayaku Co., Ltd.) as an acid-modified oligomer, 10% by weight of polyfunctional epoxy acrylate (available from NipponKayaku Co. , Ltd.'s DPEA-12), 3% by weight of DarocurTPO (Ciba Specialty Chemicals Inc.) as a photoinitiator, 16% by weight of YDCN-500-80P (KukdoChemicalCo., Ltd.) as a heat-curable adhesive, 1% by weight of 2-phenylimidazole as a heat-curable catalyst, 15% by weight of B-30 (Sakai Chemical Co., Ltd.) as a filler, 0.5% by weight of BYK-333 (BYK Company) as an additive, and 13 % by weight of DMF as a solvent was mixed with each other, then stirred, and the filler was dispersed by a three-roll mill to prepare a photocurable and thermally curable resin composition.

[0117] (2) Preparation of solder mask dry film (using a transparent carrier film with slight unevenness)

[0118] The prepared resin composition was applied on PET us...

Embodiment 2

[0124] (1) Preparation of solder mask dry film

[0125] By adding 41.5% by weight of ZFR-1122 (NipponKayaku Co., Ltd.) as an acid-modified oligomer, 10% by weight of polyfunctional epoxy acrylate (available from NipponKayaku Co. , Ltd.'s DPEA-12), 3% by weight of DarocurTPO (Ciba Specialty Chemicals Inc.) as a photoinitiator, 16% by weight of YDCN-500-80P (KukdoChemicalCo., Ltd.) as a heat-curable adhesive, 1% by weight of 2-phenylimidazole as a heat-curable catalyst, 15% by weight of B-30 (Sakai Chemical Co., Ltd.) as a filler, 0.5% by weight of BYK-333 (BYK Company) as an additive, and 13 % by weight of DMF as a solvent was mixed with each other, then stirred, and the filler was dispersed by a three-roll mill to prepare a photocurable and thermally curable resin composition.

[0126] (2) Preparation of solder mask dry film (using a transparent carrier film with slight unevenness)

[0127] The prepared resin composition was applied on PET used as a transparent carrier film ...

Embodiment 3

[0133] (1) Preparation of solder mask dry film

[0134] By adding 41.5% by weight of ZFR-1122 (NipponKayaku Co., Ltd.) as an acid-modified oligomer, 10% by weight of polyfunctional epoxy acrylate (available from NipponKayaku Co. , Ltd.'s DPEA-12), 3% by weight of DarocurTPO (Ciba Specialty Chemicals Inc.) as a photoinitiator, 16% by weight of YDCN-500-80P (KukdoChemicalCo., Ltd.) as a heat-curable adhesive, 1% by weight of 2-phenylimidazole as a heat-curable catalyst, 15% by weight of B-30 (Sakai Chemical Co., Ltd.) as a filler, 0.5% by weight of BYK-333 (BYK Company) as an additive, and 13 % by weight of DMF as a solvent was mixed with each other, then stirred, and the filler was dispersed by a three-roll mill to prepare a photocurable and thermally curable resin composition.

[0135] (2) Preparation of solder mask dry film (using a transparent carrier film with slight unevenness)

[0136] The prepared resin composition was applied on PET used as a transparent carrier film by...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
roughnessaaaaaaaaaa
uniformity indexaaaaaaaaaa
visible light transmittanceaaaaaaaaaa
Login to View More

Abstract

The present invention relates to: a method for preparing a dry film solder resist capable of allowing a dry film solder resist, having surface micro protrusions, to be formed by a more simplified method; and a film laminate used therein. The method for preparing a dry film solder resist comprises the steps of: forming a predetermined photocurable and thermosetting resin composition on a transparent carrier film having surface micro protrusions with an average roughness (Ra) of 200 nm to 2 Mum; forming a layered structure in which a substrate, the resin composition and the transparent carrier film are sequentially formed by layering the resin composition on the substrate; exposing the resin composition and stripping the transparent carrier film; and alkali developing the resin composition of an unexposed portion and thermally curing the same.

Description

【Technical field】 [0001] The present invention relates to a method for producing a solder resist dry film (DFSR), and a laminated film used therein, capable of forming a DFSR having micro unevenness on the surface by a more simplified method. 【Background technique】 [0002] With the miniaturization and weight reduction of various electronic devices, photosensitive solder resists capable of forming minute opening patterns have been used in printed circuit boards, semiconductor packaging substrates, flexible circuit boards, and the like. [0003] In general, solder resists are required to have properties such as developability, high-resolution characteristics, insulation, soldering heat resistance, gold plating resistance, and the like. In addition, when applying solder resist to semiconductor package substrates and the like, in order to secure ease of method, such as securing excellent adhesion with materials used in subsequent processes or securing release from epoxy molding...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/11H05K3/00G03F7/26
CPCG03F7/027G03F7/038G03F7/09G03F7/40H05K3/281H05K3/3452G03F7/11G03F7/16G03F7/20G03F7/26G03F7/327H01L21/4846H05K3/027
Inventor 郑珉寿庆有真崔炳柱郑遇载崔宝允李光珠具世真
Owner LG CHEM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com