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Image sensing element and manufacturing method thereof

A technology of sensing element and manufacturing method, which is applied in electrical elements, image communication, radiation control devices, etc., can solve the problem of image sensing chip being easily contaminated

Inactive Publication Date: 2009-10-14
SYNAGE TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Another object of the present invention is to provide a method for manufacturing an image sensing element, so as to improve the defect that the image sensing chip is easily contaminated during the manufacturing process

Method used

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  • Image sensing element and manufacturing method thereof
  • Image sensing element and manufacturing method thereof
  • Image sensing element and manufacturing method thereof

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Embodiment Construction

[0027] figure 2 is a schematic cross-sectional view of an image sensing element according to an embodiment of the present invention. see figure 2 The image sensor element 200 includes a circuit board 210 , an image sensor chip 220 , a plurality of wires 230 , a first annular colloid 240 a , a second annular colloid 240 b and a filter 250 . Wherein, the circuit board 210 is, for example, a flexible circuit board or a general printed circuit board (printed circuit board, PCB). The image sensor chip 220 is disposed on the circuit board 210 and has an active surface 222 away from the circuit board 210 . A plurality of wires 230 are electrically connected to the image sensor chip 220 and the circuit board 210 , and the wires 230 can be connected between the image sensor chip 220 and the circuit board 210 by wire bonding technology. The first annular glue 240 a is disposed on the circuit board 210 , surrounds the image sensor chip 220 , and covers the surrounding areas of the w...

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PUM

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Abstract

The invention discloses an image sensing element, which comprises a circuit board, an image sensing chip, a plurality of wires, a first annular colloid, a second annular colloid and a filter. The image sensor chip is arranged on the circuit board, and the image sensor chip has an active surface away from the circuit board. A plurality of wires are electrically connected to the image sensor chip and the circuit board. The first annular colloid is configured on the circuit board. The first annular colloid surrounds the image sensor chip and covers the surrounding areas of the wires and the active surface. The second annular colloid is configured on the first annular colloid. The optical filter is arranged on the second annular colloid to cover the image sensor chip. In this way, the image sensor chip is not easily stained by dust.

Description

technical field [0001] The present invention relates to a sensing element and its manufacturing method, and in particular to an image sensing element and its manufacturing method. Background technique [0002] A complementary metal-oxide semiconductor image sensor (CIS) is compatible with a complementary metal-oxide semiconductor (CMOS) process. Since the image sensor can be easily integrated with other peripheral circuits on the same chip, the cost and power consumption of the image sensor can be greatly reduced. In addition, in recent years, CMOS image sensors have become a substitute for charge-coupled devices in low-cost applications, and the importance of CMOS image sensors is increasing day by day. [0003] figure 1 It is a schematic cross-sectional view of an existing image sensing element. see figure 1 , the image sensing element 100 includes a flexible circuit board (flexible circuit board) 110, an image sensing chip (image-sensing chip) 120, a plurality of wire...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H01L27/146
Inventor 黄崇仁陈吉元卢叔东
Owner SYNAGE TECH CORP
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