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Laser thin film poly-silicon annealing optical system

An optical system, laser technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve problems such as high maintenance cost and energy sensitivity

Active Publication Date: 2009-12-23
西默有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0021] The JSW ELA system has relatively simple optics for crystallization and activation, but the JSWELA system produces a small-grained microstructure and has a TFT mobility performance of only about 100 and a throughput of only 25 wafers per hour amount, relatively high maintenance cost per chip, and process margin that is not sensitive to focus but sensitive to energy

Method used

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  • Laser thin film poly-silicon annealing optical system
  • Laser thin film poly-silicon annealing optical system
  • Laser thin film poly-silicon annealing optical system

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Embodiment Construction

[0047]Applicants have proposed a directional SLS system with simple optics for crystallization and activation that produces or can essentially produce grains that extend the length of the workpiece, resulting in a mobility of 200-400 ) and a throughput of 35 sheets per hour. The applicant's proposed system is approximately 37% less expensive per piece of maintenance than the JWS ELA system and has a process margin that is not energy or focus sensitive compared to the JWS system.

[0048] For a sheet size of 370 x 470, applicants propose to utilize a portion of the beam's ability to cover a workpiece sheet including a substrate in one scan with an elongated thin beam of 365 x 0.02 mm or less, And use a thin and thin beam of 730×0.02mm to cover a workpiece sheet of 730×920 in a single scan with a laser repetition rate of at least 4000Hz, such as 90% overlap, such as a scanning step of 0.002mm, and a scanning length of 470mm. In one case 23,500 crystallization shots could be per...

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Abstract

A gas discharge laser crystallization apparatus and method for performing a transformation of a crystal makeup or orientation in a film on a workpiece is disclosed, which may comprise a master oscillator power amplifier MOPA or power oscillator power amplifier configured XeF laser system producing a laser output light pulse beam at a high repetition rate and high power with a pulse to pulse dose control; an optical system producing an elongated thin pulsed working beam from the laser output light pulse beam. The apparatus may further comprise the laser system is configured as a POPA laser system and further comprising: relay optics operative to direct a first output laser light pulse beam from a first laser PO unit into a second laser PA unit; and, a timing and control module timing the creation of a gas discharge in the first and second laser units within plus or minus 3 ns, to produce the a second laser output light pulse beam as an amplification of the first laser output light pulse beam. The system may comprise divergence control in the oscillator laser unit. Divergence control may comprise an unstable resonator arrangement. The system may further comprise a beam pointing control mechanism intermediate the laser and the workpiece and a beam position control mechanism intermediate the laser and the workpiece. Beam parameter metrology may provide active feedback control to the beam pointing mechanism and active feedback control to the beam position control mechanism.

Description

field of invention [0001] The present invention relates to pulsed laser systems for use in machining processes involving the treatment of surfaces and / or substrates with lasers at large areas and high repetition rates, high power and pulse-to-pulse dose stability, and more specifically, relates to thin-line optical pulse delivery systems. [0002] related application : This application claims priority to U.S. Application Serial No. 10 / 884,101, filed July 1, 2004, entitled "LASER THIN FILMPOLY-SILICON ANNEALING OPTICAL SYSTEM," which It was submitted on February 18, 2004, named "VERY HIGH ENERGY, HIGH STABILITY GAS DISCHARGE LASER SURFACETREATMENT SYSTEM (very high energy, high stability gas discharge laser surface treatment system)", serial number 10 / 781,251 (lawyer file No. 2003-0105-02), the U.S. application filed on November 26, 2003, entitled "VERY HIGH ENERGY, HIGH STABILITY GASDISCHARGE LASER SURFACE TREATMENT SYSTEM (very high energy, high stability Gas Discharge Las...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/064B23K26/066
CPCB23K26/0738B23K26/0732
Inventor 威廉·N·帕特罗帕拉什·P·达斯拉塞尔·赫迪玛迈克尔·托马斯
Owner 西默有限公司
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