Chip supplying unit loading device

A technology of supply unit, loading device, applied in the direction of door/window protection device, electrical components, transportation and packaging, etc., can solve problems such as damage, chip 3 damage, etc.

Inactive Publication Date: 2007-09-12
TOP ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the chip supply unit W collides with other parts while conveying, it may be

Method used

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  • Chip supplying unit loading device
  • Chip supplying unit loading device
  • Chip supplying unit loading device

Examples

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Embodiment Construction

[0026] Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.

[0027] A chip supply unit loading device according to the present invention will be explained with reference to FIG. 4 .

[0028] 4 is a perspective view showing a wafer supply unit of a die bonding apparatus to which the present invention is applied, and which has a die supply unit loading device according to the present invention.

[0029] The chip supply unit loading device is installed between the table 200 and the cassette unit 310 of the chip bonding device. The workbench 200 is provided at one side of the base 80, the cassette unit 300 includes a cassette 310, and the chip supply unit W1 can be loaded into the cassette.

[0030] The side wall of the cassette 310 of the tape cassette unit 300 is provided with a groove 311 with a certain length and depth, and the side of the chip supply unit W1 can be inserted into t...

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PUM

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Abstract

The invention discloses a chip supply unit load device including: transmission unit installed at frame; transmission arm able to reciprocate through the transmission unit; clamping unit installed at the transmission arm and reciprocating together with the transmission arm and which is used for loading the chip supply unit on work table or unloading the same from the work table while it linearly contacts with the chip supply unit. Thus, the invention can re-load the chip supply unit having been loaded in belt box unit into the belt box unit quickly and stably. Therefore, damage on the chip supply unit during the transmission process can be avoided thereby minimizing defect during adhesive treatment and reducing adhesive treatment time.

Description

technical field [0001] The present invention relates to a chip supply unit loading device, in particular, the present invention relates to a chip supply unit loading device capable of quickly and smoothly transferring a chip supply unit loaded into a cassette to a workbench, and Quickly and smoothly reload the chip supply unit loaded on the table into the cassette. Background technique [0002] Generally, a liquid crystal display (LCD) device is provided with a plurality of driving circuits on its LCD panel. Each drive circuit is embodied as a drive IC (Integrated Circuit) chip and a plurality of connection terminals connected to the drive IC chip. [0003] A process of manufacturing a driving circuit will be explained with reference to FIG. 1 . [0004] First, the leads of the driver IC chip 3 are respectively bonded to the metal pattern 2 of the tape T having the metal pattern 2 on the insulating film 1 by bonding means. The metal pattern 2 forms a plurality of connecti...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/687H01L21/50
CPCE06B9/36E06B9/78
Inventor 李旻炯
Owner TOP ENG CO LTD
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