Method for controlling administration robot by statistical process

Abstract

A method of utilizing statistical process to control supervisor includes sending chip to measurer after a process is finished by said chip and said chip is moved out from reaction chamber, obtaining number of said chip and obtaining number of reaction chamber as per number of chip then obtaining an image point according to measurement result, enabling to obtain multiple image point by said means, using obtained multiple image point to make group operation for discomposing control drawing to be multiple control drawing and carrying out regulation on abnormal reaction chamber according to analysis result of each control drawing.

Description

technical field [0001] The present invention relates to statistical process control of semiconductor processes, and more particularly to a method of managing machines using statistical process control. Background technique [0002] With the development of semiconductor manufacturing related technologies, the complexity of semiconductor product manufacturing is increasing day by day. At present, in the manufacture of semiconductor products, due to factors such as size or arrangement, the tolerance for errors is very small. However, in complex processes, errors often occur due to poor process parameters. Since there is no previous process data for reference when the semiconductor product is first produced, it is impossible to properly set process or tool-related process parameters. Therefore, the aforementioned errors are particularly prone to occur when the semiconductor product is first produced. [0003] In a semiconductor manufacturing enterprise, fabrication machines ma...

AI Technical Summary

Problems solved by technology

Due to the high manufacturing cost of 12-inch wafers, if it is not possible to know the changes in the control chart of each wafer during the process execution in real time to perform the corresponding process operations, but wait until all the wafers in each batch complete the process Further adjustments may cause greater wafer damage (WaferDamage)

In addition, in the process machine, different reaction chambers may produce different manufacturing conditions, so wafers produced in different reaction chambers will have differences

If each map point of the statistical process control of the batch level (Lot-level) is used for control, the differences produced by different reaction chambers will be diluted on average in the same statistical process control map point on the chart display, so it cannot Real-time reflection of wafer damage caused by changes in the performance of a reaction chamber

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