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Polishing pad

A polishing pad and annular groove technology, applied in the field of polishing pads, can solve the problems of complex polishing pad manufacturing, polishing pad peeling, and difficulty in distinguishing front and back sides from each other.

Inactive Publication Date: 2008-02-06
TOHO ENG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] (Problem 1) Depending on the material of the polishing pad, it is difficult to achieve sufficient elasticity by forming grooves only in the back of the pad
However, forming grooves on the front and back sides of the polishing pad makes the manufacture of the polishing pad very complicated, leading to fears that the production efficiency will drop sharply
[0013] (Problem 3) In the case of a polishing pad in which the front and back are distinguished from each other according to molding conditions and the like, once grooves are formed on the front and back of the pad, it is difficult to distinguish the front and back from each other
As a result, the pad sits upside down on the plate, potentially resulting in underpolishing
[0014] (Question 4) Forming a groove on the back side of the polishing pad causes the bonding area of ​​the polishing pad against the rotating platen to reduce the opening area of ​​the groove
In addition, when polishing processing is performed using slurry, etc., as in the CMP method, the slurry may spread over a large area on the back side of the polishing pad.
As a result, the polishing pad may peel off from the rotary platen, etc.

Method used

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Experimental program
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Embodiment B

[0188] Referring to FIGS. 5-7 , there is shown a polishing pad 48 constructed in accordance with one embodiment of the invention as defined in claim 2 or 13 .

[0189] More specifically, polishing pad 48 is comprised of a thin disk-shaped pad substrate 12 having a generally constant thickness dimension T. As shown in FIG. The backing substrate 12 is advantageously formed of a rigid foamed or non-foamed synthetic resin material, a rigid rubber material, a textile material, an inorganic material or other possible materials. In this embodiment, the pad substrate 12 is formed of foamed polyurethane, for example. The pad thickness dimension is not particularly limited, and may be appropriately selected not only according to the material of the pad substrate 12 but also according to the material of the wafer to be polished, required polishing accuracy, and the like.

[0190]As shown in FIG. 5 , one surface of the base substrate 12 , that is, the front surface 14 has a front surface...

Embodiment C

[0274] Reference is next made to FIGS. 16-18 , which illustrate a polishing pad 74 constructed in accordance with one embodiment of the invention as defined in any one of claims 1 , 3 , 4 , 5 , 8 and 13 .

[0275] More specifically, the polishing pad 74 is composed of a thin disc-shaped pad substrate 12 having a generally constant thickness dimension T. As shown in FIG. The backing substrate 12 is advantageously formed of a rigid foamed or non-foamed synthetic resin material, a rigid rubber material, a textile material, an inorganic material or other possible materials. In this embodiment, the pad substrate 12 is formed of foamed polyurethane, for example. The pad thickness dimension is not particularly limited, and may be appropriately selected not only according to the material of the pad substrate 12 but also according to the material of the wafer to be polished, required polishing accuracy, and the like.

[0276] One surface of the base substrate 12 , that is, the front s...

Embodiment D

[0389] Reference is next made to FIGS. 54-56 , which illustrate a polishing pad 98 , 100 constructed in accordance with another embodiment of the invention as defined in claim 9 or 13 .

[0390] More specifically, each polishing pad 98, 100 is comprised of a thin disk-shaped pad substrate 12 having a generally constant thickness dimension T. As shown in FIG. The backing substrate 12 is advantageously formed of a rigid foamed or non-foamed synthetic resin material, a rigid rubber material, a textile material, an inorganic material or other possible materials. In this embodiment, the pad substrate 12 is formed of foamed polyurethane, for example. The pad thickness dimension is not particularly limited, and may be appropriately selected not only according to the material of the pad substrate 12 but also according to the material of the wafer to be polished, required polishing accuracy, and the like.

[0391] The front surface 14 , which is one surface of the pad substrate 12 , i...

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PUM

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Abstract

A polishing pad having a novel structure, which is applicable to highly accurate various polishing process, such as a CMP process, is provided. An annular rear plane groove (22) extending in a circumferential direction is formed on a rear plane (20) of the polishing pad.

Description

technical field [0001] The present invention relates to a polishing pad, and more particularly, to a polishing pad for grinding the surface of a processing object requiring very high processing accuracy, such as a semiconductor wafer, a semiconductor substrate, and a glass substrate. Background technique [0002] In the process of manufacturing semiconductor devices such as LSI devices, for example, a laminated structure of various types of thin layers including metal layers and insulating layers is formed on a silicon wafer to manufacture a semiconductor substrate. During this fabrication process, the surface of each thin layer is planarized. As a main method of planarizing the surface of each thin layer, chemical mechanical polishing (hereinafter referred to as "CMP") is known. According to the CMP method, a thin disc-shaped polishing pad made of a synthetic resin material or its foamed material can be used, and a slurry containing particles and a suitable type of liquid ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00H01L21/304B24B37/20
CPCB24B37/26
Inventor 铃木辰俊
Owner TOHO ENG CO LTD
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