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Built-in three-dimension digital imaging device and its method

A three-dimensional digital and imaging device technology, applied in image communication, image data processing, instruments, etc., can solve the problems of complex hardware structure, low reliability, high power consumption, etc., and achieve small size, high reliability, and low power consumption. Effect

Inactive Publication Date: 2010-05-19
SHENZHEN UNIV
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Problems solved by technology

[0011] Documents [4, 5, 6] are related domestic and foreign patents on 3D digital imaging. They all use general-purpose computers and image acquisition cards to realize 3D digital imaging. The system hardware structure is complex, the reliability is low, and the power consumption is large.

Method used

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specific Embodiment

[0085] Step 4 of fringe processing task) fringe analysis is the core algorithm of the system. For the DSP processor, we use fixed-point arithmetic to realize the fringe analysis calculation process (including phase shift algorithm and time phase expansion operation), (fixed-point number is computer representation A kind of method of numerical value, computer uses two kinds of methods of fixed point and floating point to represent actual numerical value.) The specific embodiment is as follows:

[0086] The device of the present invention can adopt, for example, five times of phase-shifting method to analyze the phase, and n pieces of different phase-shift fringe patterns of a frequency pattern collected are respectively I 1 , I 2 ,..., I n . then the phase In the formula, x and y are the pixel coordinates of the image, and the sin and cos trigonometric functions are calculated using a lookup table. arctangent function tg -1 (The x solution uses a segmented lookup table an...

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Abstract

The utility model relates to an embedded three-dimensional digital imaging device and method, comprising a signal processing board arranged to a LCD, a digital projection unit and a sensor unit respectively to form an integral three-dimensional digital imaging device. The method of the device is as the below: (1) the digital projector is controlled by the signal processing board to generate spatial carrier-structured lighting that carrier fringe patterns are projected on the surface of the object; (2) coded fringe patterns on the surface of the object acquired by the CCD or CMOS sensor unit are collected by the signal processing board; (3) automatic fringe analysis is conducted by the embedded digital signal processor DSP assembled by the signal processing board to work out a phase distribution diagram relevant to height of the object and a three-dimensional digital image of the object; the DSP application program comprises five modules, namely, the main function module, the fringe processing task module, the spatial carrier fringe projection module, the coded fringe collection module and the image display module. The utility model has the advantages of high integrity, fast imaging, low power consumption and ability to realize fast three-dimensional digital imaging with multiple resolutions.

Description

technical field [0001] The invention relates to a digital imaging method and device. In particular, it relates to a device that automatically completes spatial carrier fringe pattern projection, image acquisition, and coded fringe pattern processing in one device. It has good flexibility and reconfigurability, and is suitable for three-dimensional sensing measurement of arbitrary complex surface contours. Embedded three-dimensional digital imaging device and method thereof. Background technique [0002] 3D Digital Imaging and Modeling (3DIM-3D Digital Imaging and Modeling) is an emerging interdisciplinary field that has been actively researched internationally in recent years. It is widely used in reverse engineering, cultural relics protection, medical diagnosis, industrial detection and virtual reality and many other aspects. As one of the main means of obtaining 3D information, the 3D active vision system based on phase mapping has the advantages of fast speed, high res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N13/00G06T17/00
Inventor 彭翔王晓东田劲东
Owner SHENZHEN UNIV
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